5SGXEA7N3F45C4N

The 5SGXEA7N3F45C4N is a Stratix V GX Field Programmable Gate Array (FPGA) IC designed for high-density programmable-logic implementations. It combines a large logic fabric with substantial embedded memory and high I/O count for designs that require extensive on-chip resources and connectivity.

This device is supplied in a 1932-BBGA FCBGA package for surface-mount board assembly and is specified for commercial-grade operation with a 0 °C to 85 °C ambient temperature range.

Key Features

• Logic Capacity — 622,000 logic elements to implement complex state machines, datapaths, and custom logic functions.
• Embedded Memory — Approximately 51.2 Mbits of embedded memory for buffering, LUT-based storage, and on-chip data structures.
• I/O Density — 840 user I/Os to support multiple external interfaces, parallel buses, and extensive sensor/peripheral connectivity.
• Power and Core Supply — Core voltage range specified at 820 mV to 880 mV to match low-voltage power architectures.
• Package & Mounting — 1932-BBGA, FCBGA package; supplier device package listed as 1932-FBGA, FC (45×45); surface-mount for compact board integration.
• Commercial Grade & Temperature — Commercial temperature grade with operating range from 0 °C to 85 °C.
• RoHS Compliance — Device is RoHS compliant.
• Family Transceiver Capability (series-level) — The Stratix V GX family referenced in the datasheet includes GX transceiver speed grades such as GX channel—14.1 Gbps, 12.5 Gbps, and 8.5 Gbps (series-level specification).

Typical Applications

• High-density programmable logic — Leverage 622,000 logic elements and approximately 51.2 Mbits of embedded memory for complex custom logic implementations and algorithm acceleration.
• I/O-intensive systems — Use the 840 user I/Os to interface with multiple external devices, parallel buses, and mixed-signal front ends.
• Space-constrained board designs — The 1932-BBGA FCBGA surface-mount package enables high integration in compact PCB layouts.
• Low-voltage core systems — Core supply range of 820 mV to 880 mV aligns with modern low-voltage power domains on advanced PCBs.

Unique Advantages

• Highly integrated logic and memory: Combines 622,000 logic elements with approximately 51.2 Mbits of embedded memory to reduce external component count and simplify board-level architecture.
• Extensive I/O capacity: 840 user I/Os provide flexibility to consolidate multiple functions and interfaces onto a single device.
• High-density BGA packaging: 1932-BBGA/1932-FBGA package formats enable a compact footprint while supporting large resource counts.
• Commercial temperature specification: Rated for 0 °C to 85 °C operation to meet standard commercial deployment environments.
• RoHS compliant: Meets RoHS requirements for environmentally conscious designs and supply-chain compliance.
• Series-level transceiver options: Stratix V GX family transceiver speed grades are documented in the datasheet, supporting a range of high-speed channel options at the series level.

Why Choose 5SGXEA7N3F45C4N?

The 5SGXEA7N3F45C4N positions itself as a high-capacity, I/O-rich Stratix V GX FPGA for designs requiring large amounts of on-chip logic and memory in a compact BGA package. Its combination of 622,000 logic elements, approximately 51.2 Mbits of embedded memory, and 840 user I/Os provides the building blocks for consolidating complex system functions onto a single programmable device.

With a surface-mount 1932-BBGA package, a low-voltage core supply range, commercial operating temperature rating, and RoHS compliance, this device is suited to commercial embedded and board-level applications that need high integration, flexible I/O, and substantial on-chip resources. The Stratix V GX family transceiver specifications are provided at the series level in the datasheet for designs that consider high-speed channel options.

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