5SGXEA7N3F45I3LG

The 5SGXEA7N3F45I3LG is a Stratix® V GX Field Programmable Gate Array (FPGA) from Intel, offered in an industrial temperature grade and a 1932-BBGA FCBGA package. This high-density FPGA combines large programmable logic capacity, substantial on-chip RAM, and a very high I/O count to address designs that require dense integration and robust operation over extended temperature ranges.

As a Stratix V GX device, the family supports multi-gigabit transceiver speed grades defined in the device datasheet; refer to the datasheet for device-specific transceiver speed grade availability and electrical characteristics.

Key Features

• Core / Logic 622,000 logic elements for large-scale programmable logic and complex system integration.
• Embedded Memory Approximately 51.2 Mbits of total on-chip RAM to support buffering, packet processing, and large state machines.
• I/O Density 840 general-purpose I/Os to support high-pin-count interfaces, parallel buses, and dense peripheral connectivity.
• Power Core voltage supply range of 820 mV to 880 mV for the device core power domain.
• Package & Mounting 1932-BBGA (FCBGA) package, supplier device package 1932-FBGA, FC (45×45); surface-mount device for PCB assembly.
• Temperature & Grade Industrial temperature rating: –40 °C to 100 °C, qualifying the device for extended-environment applications.
• Standards & Compliance RoHS compliant.

Typical Applications

• High-speed communications: Use the Stratix V GX family’s transceiver speed grade options (as documented in the datasheet) and abundant I/O to implement multi-gigabit links and packet-processing logic.
• Network and connectivity equipment: Large logic capacity and significant on-chip RAM enable complex switching, buffering, and protocol handling in network infrastructure designs.
• Industrial control and automation: Industrial temperature grading and high I/O count make this device suitable for control systems requiring reliable operation across –40 °C to 100 °C.
• High-density system integration: Deploy as a single FPGA solution to consolidate multiple functions—protocol bridging, custom logic, and memory buffering—onto one device.

Unique Advantages

• High logic and memory density: 622,000 logic elements combined with approximately 51.2 Mbits of embedded memory reduce the need for external devices and enable larger in-FPGA designs.
• Very high I/O count: 840 I/Os support complex board-level connectivity and multiple parallel interfaces without extensive external multiplexing.
• Industrial temperature rating: –40 °C to 100 °C operation supports deployments in harsh and temperature-variable environments.
• Compact, high-pin-count package: 1932-BBGA FCBGA packaging provides a space-efficient solution for high-density system boards.
• Low-voltage core domain: 820 mV–880 mV supply range aligns with modern low-voltage FPGA core requirements for power-optimized system design.
• Regulatory compliance: RoHS compliance simplifies environmental and material-control considerations for production.

Why Choose 5SGXEA7N3F45I3LG?

The 5SGXEA7N3F45I3LG positions itself as a high-capacity, industrial-grade Stratix V GX FPGA suited to designs that demand extensive logic resources, large embedded memory, and substantial I/O. Its package and power characteristics make it appropriate for dense, performance-focused systems that must also meet industrial operating conditions.

Engineers selecting this device gain a clear specification set—logic capacity, memory size, I/O count, supply range, and temperature rating—documented in the device datasheet and intended for complex communications, networking, industrial control, and high-density integration projects.

Request a quote or submit a procurement inquiry to obtain pricing and availability for 5SGXEA7N3F45I3LG.