5SGXEA7N3F45I3N

The 5SGXEA7N3F45I3N is a Stratix® V GX field programmable gate array (FPGA) IC from Intel, offered in an industrial temperature grade. This device integrates a high logic element count and substantial on-chip memory to support complex, high-density digital designs.

Key characteristics for this part include 622,000 logic elements, approximately 51.2 Mbits of embedded memory, 840 I/O pins, and a low-voltage core supply range of 820 mV to 880 mV. The device is supplied in a 1932-ball BGA (FCBGA) package suitable for surface-mount assembly.

Key Features

• Core Logic 622,000 logic elements for high-density implementation of complex logic, datapaths, and custom accelerators.
• Embedded Memory Approximately 51.2 Mbits of on-chip RAM to support large buffering, lookup tables, and state storage without external memory.
• I/O Capacity 840 I/O pins to accommodate dense peripheral connectivity and high-pin-count system interfaces.
• Power and Supply Core voltage supply range of 820 mV to 880 mV, enabling operation at the specified low-voltage core levels.
• Package and Mounting 1932-ball FCBGA (45 × 45 mm) package, surface-mount compatible for automated PCB assembly and high pin-density routing.
• Temperature and Grade Industrial grade operation with an operating temperature range of −40 °C to 100 °C for deployment in demanding environments.
• RoHS Compliance Device is RoHS compliant, supporting regulated material requirements for many electronic assemblies.

Typical Applications

• High-speed connectivity and transceiver-based systems The Stratix V GX family includes transceiver capabilities and speed grades defined in the device series documentation, supporting designs that require high-speed serial I/O.
• High-density digital processing Large logic element and memory resources enable implementation of complex signal processing, data-paths, and custom acceleration functions.
• Systems requiring extensive I/O With 840 I/O pins, the device suits applications that need numerous parallel interfaces or broad peripheral integration.

Unique Advantages

• High logic density: 622,000 logic elements provide the resources needed for large-scale integration of custom logic and datapaths.
• Significant on-chip memory: Approximately 51.2 Mbits of embedded RAM reduces dependence on external memory for buffering and state storage.
• Extensive I/O: 840 I/Os simplify board-level connectivity and enable complex multi-interface designs.
• Industrial temperature range: Rated from −40 °C to 100 °C for reliable operation across a wide range of environmental conditions.
• Low-voltage core operation: 820 mV to 880 mV supply supports optimized power domains for core logic.
• RoHS compliant packaging: Meets common material restrictions for contemporary electronics manufacturing.

Why Choose 5SGXEA7N3F45I3N?

The 5SGXEA7N3F45I3N positions itself as a high-density Stratix V GX FPGA option for designs that require substantial on-chip logic, memory, and I/O capacity within an industrial temperature envelope. Its combination of 622,000 logic elements, approximately 51.2 Mbits of embedded RAM, and 840 I/Os supports complex system integration while maintaining low-voltage core operation.

This device is appropriate for teams building scalable, high-performance FPGA-based systems who require the packaging, thermal range, and electrical characteristics documented for the Stratix V GX family. Long-term value derives from the device’s capacity to consolidate functions on-chip and the technical support associated with the Stratix V series.

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