5SGXEA7N3F45I4N

The 5SGXEA7N3F45I4N is an industrial-grade Stratix V GX field programmable gate array (FPGA) offering high logic capacity, abundant embedded memory, and extensive I/O capability in a 1932-ball FCBGA package. It is designed for applications that require a large programmable fabric with robust operating range and surface-mount packaging.

With 622,000 logic elements and approximately 51.2 Mbits of embedded memory, this device targets complex, high-density designs that benefit from significant on-chip resources and an extended operating temperature range of −40 °C to 100 °C.

Key Features

• Core Logic Capacity  622,000 logic elements provide a large programmable fabric for complex digital designs and high implementation density.
• Embedded Memory  Approximately 51.2 Mbits of on-chip RAM to support data buffering, state storage, and algorithm acceleration without external memory for many use cases.
• I/O Resources  840 user I/O pins to support extensive peripheral connectivity and multi-channel interfaces on a single device.
• Power Supply  Core voltage range specified at 820 mV to 880 mV to match platform power-rail planning and core-power budgeting.
• Package & Mounting  1932-ball BGA (FCBGA) surface-mount package; supplier device package references a 1932-FBGA, FC (45×45) footprint for board-level planning.
• Temperature Grade  Industrial grade with an operating temperature range of −40 °C to 100 °C for deployment in temperature-demanding environments.
• Standards Compliance  RoHS compliant.

Typical Applications

• High-density logic systems  Large-scale FPGA implementations that require substantial logic elements and embedded memory for complex algorithms and data-paths.
• I/O-intensive platforms  Systems that need a high number of IOs for multi-channel interfaces, sensors, or peripheral aggregation.
• Industrial equipment  Deployments where extended temperature range and industrial-grade components are required for reliable operation.

Unique Advantages

• Substantial on-chip resources: 622,000 logic elements and approximately 51.2 Mbits of embedded memory reduce dependence on external devices and simplify board-level BOM.
• High I/O density: 840 user I/Os enable complex system integration and support for multiple interfaces without external multiplexing.
• Industrial temperature support: Rated for −40 °C to 100 °C, supporting designs that require extended environmental tolerance.
• Compact surface-mount package: 1932-BBGA (FCBGA) footprint allows high-density PCB integration while maintaining a large device resource set.
• Defined core voltage range: 820 mV–880 mV supply specification aids precise power supply design and thermal planning.
• Compliance-ready: RoHS compliance supports regulatory and manufacturing requirements for lead-free production.

Why Choose 5SGXEA7N3F45I4N?

The 5SGXEA7N3F45I4N positions itself as a robust, high-capacity FPGA option for designs that demand large programmable logic, significant embedded RAM, and extensive I/O in an industrial-grade package. Its combination of 622,000 logic elements, approximately 51.2 Mbits of on-chip memory, and 840 I/Os makes it well suited for complex system integration where on-chip resources and environmental tolerance matter.

Designed for engineers and integrators who require scalability and reliable operation across temperature extremes, this Stratix V GX device offers a balance of density, connectivity, and board-level integration in a 1932-ball FCBGA package.

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