5SGXEA7N3F45I4G

The 5SGXEA7N3F45I4G is a Stratix® V GX Field Programmable Gate Array (FPGA) IC offering large on‑chip resources and high I/O density in a surface‑mount BGA package. This industrial‑grade device provides 622,000 logic element cells, approximately 51.2 Mbits of embedded memory, and 840 general‑purpose I/Os, with a supply voltage range of 820 mV to 880 mV and an operating temperature range of –40 °C to 100 °C.

Key Features

• Core logic — 622,000 logic element cells to implement complex programmable logic and custom hardware functions.
• Embedded memory — Approximately 51.2 Mbits of on‑chip RAM to support data buffering, state storage, and memory‑intensive algorithms.
• I/O capacity — 840 programmable I/Os for dense external connectivity and interface consolidation.
• Transceiver speed grades (family) — Stratix V GX family transceiver speed grades (per Stratix V datasheet) include GX channel options up to 14.1 Gbps, with additional 12.5 Gbps and 8.5 Gbps grades specified at the family level.
• Power requirements — Voltage supply range of 820 mV to 880 mV.
• Package & mounting — 1932‑BBGA, FCBGA package; supplier device package listed as 1932‑FBGA, FC (45×45); surface mount.
• Temperature & grade — Industrial grade device rated for operation from –40 °C to 100 °C.
• Environmental compliance — RoHS compliant.

Typical Applications

• High‑I/O systems — Designs requiring a large number of external interfaces can leverage the device's 840 I/Os to consolidate boards and simplify routing.
• Memory‑intensive logic — Applications that need substantial on‑chip RAM alongside significant logic capacity benefit from approximately 51.2 Mbits of embedded memory and 622,000 logic elements.
• Industrial deployments — Industrial equipment and systems operating across wide temperature ranges can use this industrial‑grade FPGA, rated from –40 °C to 100 °C.

Unique Advantages

• High logic capacity: Enables integration of complex algorithms and custom hardware accelerators on a single FPGA.
• Large on‑chip memory: Approximately 51.2 Mbits of embedded RAM reduces dependence on external memory and lowers BOM complexity.
• Extensive I/O count: 840 I/Os support multiple interfaces and dense connectivity without additional I/O expanders.
• Industrial temperature rating: Designed for reliable operation in environments from –40 °C to 100 °C.
• Compact, high‑density package: 1932‑BBGA (45×45) surface‑mount package supports high integration in space‑constrained designs.
• Regulatory alignment: RoHS compliance supports environmental and supply‑chain requirements.

Why Choose 5SGXEA7N3F45I4G?

The 5SGXEA7N3F45I4G delivers a balanced combination of high logic density, substantial embedded memory, and extensive I/O in an industrial‑grade Stratix V GX FPGA. Its specifications make it appropriate for engineers who need to implement complex, memory‑heavy logic and consolidate multiple interfaces while meeting industrial temperature and environmental requirements.

Device selection is supported by the Stratix V device datasheet and family documentation, enabling design teams to align device capabilities with system‑level requirements and scaling needs.

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