5SGXEA9K1H40C2L

IC FPGA 696 I/O 1517HBGA
Part Description

Stratix® V GX Field Programmable Gate Array (FPGA) IC 696 53248000 840000 1517-BBGA, FCBGA

Quantity 568 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package1517-HBGA (45x45)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1517-BBGA, FCBGANumber of I/O696Voltage820 mV - 880 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs317000Number of Logic Elements/Cells840000
Number of GatesN/AECCN3A001A2CHTS Code8542.39.0001
QualificationN/ATotal RAM Bits53248000

Overview of 5SGXEA9K1H40C2L – Stratix® V GX Field Programmable Gate Array (FPGA) IC 696 I/O, ~53.2 Mbits RAM, 840,000 logic elements, 1517-BBGA FCBGA

The 5SGXEA9K1H40C2L is a Stratix V GX Field Programmable Gate Array (FPGA) from Intel, delivered in a 1517-BBGA FCBGA package and specified as a commercial-grade device. It provides high logic capacity, significant embedded memory, and a large I/O count for complex programmable-logic designs.

Designed for systems that require dense programmable logic, extensive on-chip RAM, and broad connectivity, this device targets applications where integration and scalable programmable resources are key design drivers.

Key Features

  • High Logic Capacity — 840,000 logic elements to implement large-scale digital logic, custom processors, or complex datapaths.
  • Logic Array Resources — 317,000 logic array blocks (LABs/CLBs equivalent) for structured logic placement and routing.
  • Embedded Memory — Approximately 53.2 Mbits of on-chip RAM for data buffering, FIFOs, and on-chip storage.
  • Extensive I/O — 696 user I/O pins for flexible interfacing with peripherals, memory, and external logic.
  • Series Transceiver Capability — As a Stratix V GX device, the series device datasheet documents GX transceiver speed grades (series-level information available in the Stratix V device datasheet).
  • Power and Core Voltage — Core supply range specified at 0.820 V to 0.880 V to match system power-rail planning.
  • Package and Mounting — 1517-BBGA (FCBGA) package; supplier device package listed as 1517-HBGA (45×45); surface-mount technology for board-level integration.
  • Commercial Temperature Grade — Rated for operation from 0 °C to 85 °C for commercial applications.
  • RoHS Compliant — Conforms to RoHS requirements for lead-free assembly.

Typical Applications

  • High-density digital processing — Leverage 840,000 logic elements and ~53.2 Mbits of embedded memory for large-scale algorithm implementation and on-chip data buffering.
  • High I/O interface systems — Use 696 I/Os to connect to wide buses, multi-lane interfaces, and a variety of external devices.
  • Custom protocol and bridging — Large logic and memory resources support implementing custom protocol engines and interface bridges within a single device.

Unique Advantages

  • Large integrated logic and memory: 840,000 logic elements and approximately 53.2 Mbits of RAM reduce the need for external logic and memory components.
  • High pin-count flexibility: 696 I/Os provide design flexibility for complex board-level connectivity and multiple parallel interfaces.
  • Commercial-grade reliability: Specified operating range of 0 °C to 85 °C and RoHS compliance support standard commercial deployments.
  • Compact BGA packaging: 1517-BBGA (FCBGA) surface-mount package enables high-density board layouts while maintaining robust mechanical assembly.
  • Predictable power planning: Core supply specification of 0.820–0.880 V enables precise power-rail design and thermal budgeting.
  • Manufacturer support: Supplied by Intel with Stratix V series documentation and device-level electrical characteristics available in the series datasheet.

Why Choose 5SGXEA9K1H40C2L?

5SGXEA9K1H40C2L positions itself as a high-capacity Stratix V GX FPGA for commercial applications that require extensive programmable logic, substantial embedded memory, and a large number of I/O. The combination of 840,000 logic elements, approximately 53.2 Mbits of on-chip RAM, and a 696-pin I/O footprint supports consolidation of complex functions into a single device, simplifying system architecture.

With a defined core voltage range, surface-mount 1517-BBGA package, and commercial temperature rating, this device is suitable for designers seeking a high-density FPGA solution backed by Intel’s Stratix V series documentation and support resources.

Request a quote or submit an inquiry for 5SGXEA9K1H40C2L to receive pricing, lead-time, and availability information tailored to your project requirements.

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