5SGXEA9K1H40C2N

The 5SGXEA9K1H40C2N is a Stratix® V GX field-programmable gate array (FPGA) in a high-density FCBGA package. It delivers substantial on-chip logic and memory capacity with a large I/O complement, aimed at designs that require extensive logic resources and interface integration.

This commercial-grade device targets system and embedded designers who need high integration density, significant embedded RAM, and a compact surface-mount package for complex digital and mixed-signal applications within a 0 °C to 85 °C operating window.

Key Features

• Core Capacity  Approximately 840,000 logic elements suitable for large, multi-function FPGA designs.
• Embedded Memory  Approximately 53.25 Mbits of on-chip RAM to support packet buffers, lookup tables, and local data storage without immediate external memory dependence.
• I/O Resources  696 I/O pins to accommodate high pin-count interfaces and multiple parallel or serial buses.
• Supply Voltage  Operates from 870 mV to 930 mV, allowing designers to plan power distribution and core rail requirements precisely.
• Package & Mounting  1517-BBGA (FCBGA) package; supplier device package listed as 1517-HBGA (45×45). Surface-mount mounting type for standard PCB assembly.
• Commercial Temperature Grade  Rated for operation from 0 °C to 85 °C to suit commercial-environment applications.
• Standards Compliance  RoHS compliant.

Typical Applications

• High-density digital systems  Use the abundant logic elements and embedded RAM for complex processing pipelines, DSP, and multi-core soft-CPU implementations.
• High-pin-count interface hubs  Leverage 696 I/O for multi-channel data aggregation, parallel interfaces, and board-level protocol bridging.
• Prototyping and system integration  Compact FCBGA packaging and large resource set make the device suitable for consolidating multiple functions during prototype and integration phases.

Unique Advantages

• High logic density: Approximately 840,000 logic elements enable consolidation of complex functions on a single device, reducing board-level component count.
• Substantial on-chip memory: Roughly 53.25 Mbits of embedded RAM help minimize external memory requirements and improve deterministic data handling.
• Extensive I/O capacity: 696 available I/O pins simplify connection to multiple peripherals, sensors, and high-throughput interfaces without multiplexing compromise.
• Compact surface-mount FCBGA: 1517-ball package (45×45 supplier package) offers a high-resource footprint in a board-friendly SMT form factor.
• Commercial temperature rating: Rated 0 °C to 85 °C for deployment in standard commercial environments.
• Regulatory readiness: RoHS compliance supports environmentally conscious manufacturing and procurement.

Why Choose 5SGXEA9K1H40C2N?

The 5SGXEA9K1H40C2N positions itself as a high-capacity Stratix V GX FPGA for designers who require significant logic, memory, and I/O integration within a single surface-mount package. Its combination of approximately 840,000 logic elements, around 53.25 Mbits of embedded RAM, and 696 I/O makes it well suited to consolidate complex digital subsystems and interface-rich applications in commercial-temperature deployments.

For projects prioritizing integration density, interface bandwidth, and on-chip memory to reduce external BOM complexity, this device offers a practical platform with vendor-documented electrical and switching characteristics available in the Stratix V device datasheet.

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