5SGXEA9K1H40I2N

The 5SGXEA9K1H40I2N is an Intel Stratix V GX field‑programmable gate array (FPGA) in a 1517‑ball BGA (FCBGA) package. It provides a high density of programmable logic and on‑chip memory alongside a large I/O count for complex, high‑integration designs. Manufactured and graded for industrial use, the device targets applications that require extensive logic capacity, substantial embedded memory, and robust I/O connectivity.

Key Features

• Logic Resources — 840,000 logic elements and 317,000 logic array blocks deliver extensive programmable fabric for large, complex designs.
• Embedded Memory — Approximately 53.25 Mbits of on‑chip RAM for data buffering, state storage, and high‑throughput processing.
• I/O Capacity — 696 I/O pins to support dense board‑level connectivity and multi‑interface designs.
• Power Supply — Core voltage supply specified between 870 mV and 930 mV, enabling designers to plan for precise power delivery and regulation.
• Package & Mounting — 1517‑BBGA (FCBGA) package, supplier device package listed as 1517‑HBGA (45×45), with surface‑mount mounting type for compact, high‑density PCB integration.
• Thermal & Grade — Industrial grade device with an operating temperature range of −40 °C to 100 °C for deployment in demanding environments.
• Environmental Compliance — RoHS compliant.

Typical Applications

• High‑performance networking and communications — Large logic capacity and series‑level Stratix V GX transceiver architecture support designs requiring high‑bandwidth serial connectivity and protocol processing.
• Data center and compute acceleration — Dense programmable fabric and significant on‑chip RAM for custom packet processing, data staging, and hardware acceleration tasks.
• Industrial control and instrumentation — Industrial temperature rating (−40 °C to 100 °C) and extensive I/O make the device suitable for demanding control, automation, and measurement systems.

Unique Advantages

• High logic density: 840,000 logic elements provide the capacity to integrate multiple subsystems and complex algorithms on a single device, reducing board‑level bill of materials.
• Substantial embedded memory: Approximately 53.25 Mbits of RAM enables large buffering and low‑latency data paths without external memory in many use cases.
• Wide I/O connectivity: 696 I/O pins support multiple interfaces and dense peripheral connections for flexible system integration.
• Industrial robustness: Rated for −40 °C to 100 °C operation and RoHS compliant for use in industrial environments with strict environmental requirements.
• Compact, high‑density packaging: 1517‑BBGA (1517‑HBGA, 45×45 supplier package) provides a compact footprint for high‑density PCB designs.
• Low‑voltage core operation: Defined core supply range of 870 mV to 930 mV allows precise power budgeting and efficient core performance planning.

Why Choose 5SGXEA9K1H40I2N?

The 5SGXEA9K1H40I2N delivers a blend of high logic capacity, substantial embedded memory, and extensive I/O in a compact FCBGA package, making it well suited for complex, high‑integration applications in communications, compute acceleration, and industrial systems. Backed by Intel’s Stratix V GX family specification set, this industrial‑grade device enables designers to consolidate functions, minimize external components, and scale performance within a defined thermal and power envelope.

Engineers and procurement teams requiring a high‑density FPGA with industrial temperature support and RoHS compliance will find the 5SGXEA9K1H40I2N appropriate for long‑lifecycle, high‑performance designs.

Request a quote or submit a pricing inquiry to evaluate the 5SGXEA9K1H40I2N for your next design.