5SGXEA9K2H40C2G

The 5SGXEA9K2H40C2G is a Stratix® V GX Field Programmable Gate Array (FPGA) IC from Intel, offered in a 1517-BBGA FCBGA package with surface-mount mounting. It provides a high-density programmable fabric with 840,000 logic elements and approximately 53.2 Mbits of embedded RAM, plus 696 I/O pins for complex interfacing.

This commercial-grade device (0 °C to 85 °C) targets designs that require large on-chip logic and memory capacity, extensive I/O connectivity, and low-voltage core operation (870 mV to 930 mV).

Key Features

• Core Logic  Provides 840,000 logic elements suitable for large-scale programmable designs that require significant gate count and routing resources.
• Embedded Memory  Approximately 53.2 Mbits of on-chip RAM to support buffering, lookup tables, and on-chip data storage without external memory for many functions.
• I/O Capacity  696 user I/Os enabling high-channel-count interfaces, parallel buses, and multi-protocol connectivity.
• Power and Voltage  Core supply range of 870 mV to 930 mV to match system power-rail requirements and enable predictable power planning.
• Package & Mounting  1517-BBGA (FCBGA) package; supplier package listed as 1517-HBGA (45×45); surface-mount mounting for standard PCB assembly flows.
• Temperature Grade & Compliance  Commercial operating range of 0 °C to 85 °C and RoHS compliant.

Typical Applications

• High-density signal processing  Deploys the 840,000 logic elements and ~53.2 Mbits embedded memory to implement large datapath, filtering, and parallel processing blocks.
• Multi-channel I/O systems  Uses the 696 I/Os for dense sensor, data-acquisition, or multiport communication designs requiring many physical interfaces.
• Custom logic integration  Integrates large custom logic functions and on-chip memory to reduce external components in complex digital systems.

Unique Advantages

• High logic capacity: 840,000 logic elements provide headroom for complex digital designs and large custom accelerators.
• Substantial embedded memory: Approximately 53.2 Mbits of on-chip RAM reduces dependency on external memory for many workloads.
• Extensive I/O connectivity: 696 I/Os enable high-density interfacing and flexible system partitioning across signals and buses.
• Compact high-density package: 1517-BBGA (supplier: 1517-HBGA, 45×45) allows integration of a large FPGA in a space-efficient surface-mount form factor.
• Commercial temperature rating and RoHS compliance: Suitable for mainstream electronic products with documented environmental compliance.
• Predictable core power planning: Core voltage range of 870–930 mV supports consistent power budgeting during system design.

Why Choose 5SGXEA9K2H40C2G?

The 5SGXEA9K2H40C2G delivers a combination of high logic density, significant embedded RAM, and generous I/O resources in a single Stratix V GX FPGA package. Its specifications make it a strong choice for developers and engineers building complex programmable systems that require large on-chip resources while maintaining a commercial temperature profile.

Designed within the Stratix V family, this device is suited for teams seeking a scalable, high-capacity FPGA platform with clear electrical and package characteristics for engineering and procurement planning.

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