5SGXEA9K2H40C2N

The 5SGXEA9K2H40C2N is an Intel Stratix® V GX field-programmable gate array (FPGA) in a 1517-BBGA (FCBGA) package. This commercial-grade device integrates 840,000 logic elements, approximately 53.248 Mbits of embedded memory, and 696 user I/Os to support dense, I/O‑rich designs.

Designed for applications that require large on-chip logic and memory capacity together with high I/O count, the device offers a defined voltage supply range and a commercial operating temperature window for predictable system integration.

Key Features

• Core Logic  840,000 logic elements for large-scale programmable logic implementations.
• Embedded Memory  Approximately 53.248 Mbits of on-chip RAM to support large buffers, state storage, and local data processing.
• I/O Capacity  696 I/Os to enable extensive external interfacing and system connectivity.
• Package and Mounting  1517-BBGA (FCBGA) supplier device package 1517-HBGA (45×45), surface-mount mounting type for compact board-level integration.
• Power Supply  Specified core voltage range of 870 mV to 930 mV for system power planning.
• Temperature Grade  Commercial operating temperature range: 0 °C to 85 °C.
• Compliance  RoHS compliant.

Typical Applications

• High-density digital processing  Large logic capacity and substantial on-chip RAM make the device suitable for complex logic implementations and local memory-intensive tasks.
• Networking and communications  Extensive I/O count supports rich external interfacing required by routers, switches, and protocol bridges.
• Advanced embedded systems  Combines logic elements and embedded memory to support feature-rich embedded designs with significant integration needs.

Unique Advantages

• High logic density: 840,000 logic elements enable consolidation of large functions onto a single device, reducing board-level complexity.
• Substantial on-chip memory: Approximately 53.248 Mbits of embedded RAM supports large buffers and local data storage without external memory.
• Extensive external connectivity: 696 I/Os provide flexibility for interfacing to peripherals, sensors, memory, and high-pin-count subsystems.
• Compact FCBGA package: 1517-BBGA (supplier package 1517-HBGA, 45×45) balances high pin count with a board-friendly footprint for dense system designs.
• Defined power and thermal envelope: Core supply of 870–930 mV and a commercial temperature rating (0 °C to 85 °C) simplify system-level power and thermal planning.
• Regulatory compliance: RoHS compliance supports environmental and manufacturing requirements.

Why Choose 5SGXEA9K2H40C2N?

The 5SGXEA9K2H40C2N delivers a combination of high logic capacity, significant embedded memory, and a very large I/O complement in a 1517-BBGA (FCBGA) package. As a Stratix V GX device from Intel, it addresses designs that require dense programmable logic, abundant local memory, and extensive external interfacing within a commercial temperature range.

For engineers and procurement teams building complex FPGA-based systems, this part provides a clear specification set—logic elements, embedded RAM, I/O count, package, supply voltage, temperature range, and RoHS status—useful for fast evaluation and integration planning.

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