5SGXEA9K2H40I2
| Part Description |
Stratix® V GX Field Programmable Gate Array (FPGA) IC 696 53248000 840000 1517-BBGA, FCBGA |
|---|---|
| Quantity | 711 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 1517-HBGA (45x45) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1517-BBGA, FCBGA | Number of I/O | 696 | Voltage | 870 mV - 930 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 317000 | Number of Logic Elements/Cells | 840000 | ||
| Number of Gates | N/A | ECCN | 3A001A2C | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 53248000 |
Overview of 5SGXEA9K2H40I2 – Stratix® V GX Field Programmable Gate Array (FPGA) IC 696 I/Os, ~53.25 Mbits RAM, 840,000 Logic Elements, 1517-BBGA (FCBGA)
The 5SGXEA9K2H40I2 is a Stratix V GX family field-programmable gate array (FPGA) from Intel (Altera). It delivers very large programmable logic capacity and on-chip memory for designs that require substantial logic fabric, embedded RAM, and high I/O counts.
With industrial temperature grading and a low-voltage core supply range, this device targets demanding embedded, communications and compute-focused applications that need high integration density and robust operating margins.
Key Features
- Logic Capacity — 840,000 logic elements to implement large, complex digital functions and custom hardware accelerators.
- Logic Array Blocks — Reported fabric resources include 317,000 logic array blocks for partitioning and hierarchical design.
- Embedded Memory — Approximately 53.25 Mbits of on-chip RAM for buffering, FIFOs, caches and state storage.
- I/O Density — 696 user I/Os to support wide parallel interfaces, multi-lane links, and dense system connectivity.
- Power and Core Supply — Core voltage range of 870 mV to 930 mV for integrated low-voltage operation.
- Package & Mounting — 1517-BBGA FCBGA package (supplier designation 1517-HBGA, 45×45 mm) in a surface-mount form factor to support high-density board layouts.
- Temperature Range & Grade — Industrial grade operation from −40 °C to 100 °C for extended-environment deployments.
- RoHS Compliant — Conforms to RoHS environmental requirements.
- Stratix V GX Family Traits — Part of the Stratix V device family; device documentation covers electrical and switching characteristics, I/O timing, and transceiver options for Stratix V GX devices.
Typical Applications
- High-performance communications — Large logic fabric and high I/O count enable protocol processing, packet handling and front-end acceleration in communications equipment.
- Networking and backplane systems — Dense I/O and substantial on-chip RAM are suited to buffering, parallel interfaces and midplane/backplane data paths.
- Compute acceleration — Significant logic and memory resources support custom accelerators and data-path offload functions in compute and DSP applications.
- Embedded system integration — Industrial temperature rating and surface-mount FCBGA package make the device suitable for rugged embedded platforms requiring integration of complex logic subsystems.
Unique Advantages
- Large programmable fabric: 840,000 logic elements provide capacity to consolidate multiple SOC functions into a single device, reducing board-level complexity.
- Substantial embedded memory: Approximately 53.25 Mbits of on-chip RAM minimizes external memory requirements for many buffer- and streaming-oriented designs.
- High I/O availability: 696 I/Os allow extensive parallel interfacing and support for wide data buses or many peripheral connections.
- Industrial temperature rating: Operation from −40 °C to 100 °C supports deployment in harsh or temperature-variable environments.
- Low-voltage core: Core supply specified at 870–930 mV aligns with modern power-optimized FPGA system designs.
- High-density package: 1517-BBGA (1517-HBGA, 45×45 mm) surface-mount package enables compact board designs while accommodating the device’s large resource set.
Why Choose 5SGXEA9K2H40I2?
The 5SGXEA9K2H40I2 delivers a combination of very high logic capacity, abundant embedded memory and extensive I/O in an industrial-grade Stratix V GX device. It is positioned for engineers building systems that require integration of large digital functions, high-throughput data paths and robust operation across a wide temperature range.
For designs that prioritize on-chip resources and I/O bandwidth while maintaining low-voltage core operation and RoHS compliance, this device provides a scalable platform backed by Stratix V family documentation and device-level electrical characteristics.
Request a quote or submit a procurement inquiry for part number 5SGXEA9K2H40I2 to get pricing and availability for your project requirements.

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