5SGXEA9K2H40C3N

The 5SGXEA9K2H40C3N is a Stratix V GX field-programmable gate array (FPGA) from Intel, supplied in a 1517-BBGA FCBGA surface-mount package. This commercial-grade device provides very high logic density and substantial embedded memory to meet complex digital design requirements.

With 840,000 logic elements, approximately 53.2 Mbits of on-chip RAM, and 696 I/Os, this Stratix V GX device targets high-density system integration where large logic capacity, abundant memory, and wide I/O count are required. The device operates from a core supply range of 820 mV to 880 mV and is specified for commercial temperature operation (0 °C to 85 °C).

Key Features

• Core Logic  840,000 logic elements provide high-density programmable logic for complex digital functions and large-scale integration.
• Embedded Memory  Approximately 53.2 Mbits of on-chip RAM to support buffering, on-chip storage, and memory-intensive algorithms.
• I/O Capacity  696 user I/Os to support extensive external interfaces and multi-channel system connectivity.
• Package & Mounting  1517-BBGA (FCBGA) package, supplier device package 1517-HBGA (45×45), surface-mount for compact board-level integration.
• Power  Core voltage supply range from 820 mV to 880 mV for precise power provisioning and core performance tuning.
• Temperature & Grade  Commercial grade with an operating temperature range of 0 °C to 85 °C.
• Standards Compliance  RoHS compliant.

Typical Applications

• High-density digital systems  Designs that require hundreds of thousands of logic elements and substantial embedded memory for complex control, protocol handling, or algorithm implementation.
• Multi-I/O platforms  Systems needing large I/O counts for parallel interfaces, multiplexed sensor arrays, or multi-channel front-ends.
• Prototype and system integration  Development platforms where high logic capacity and on-chip memory enable full-system prototyping and validation.
• Networking and data handling  Applications that benefit from extensive logic and memory resources to implement packet processing, custom data paths, and aggregation functions.

Unique Advantages

• High logic density: 840,000 logic elements allow large designs to be implemented on a single device, reducing part count and board complexity.
• Substantial on-chip memory: Approximately 53.2 Mbits of embedded RAM supports buffering and memory-heavy algorithms without relying solely on external memory.
• Extensive I/O resources: 696 user I/Os enable connectivity to many peripherals and high-pin-count system architectures.
• Compact, production-ready package: 1517-BBGA/FCBGA surface-mount package provides a dense footprint for space-constrained boards while supporting high pin-count routing.
• Commercial-grade specification: Operates across a 0 °C to 85 °C range and is RoHS compliant, matching requirements for mainstream electronic products.
• Controlled core power range: Core supply specification (820 mV–880 mV) supports design planning for power distribution and thermal considerations.

Why Choose 5SGXEA9K2H40C3N?

The 5SGXEA9K2H40C3N positions itself as a high-capacity Stratix V GX FPGA option for designs that demand large programmable logic resources, significant on-chip memory, and a high number of I/Os in a compact FCBGA package. As a commercial-grade Stratix V device, it is documented within the Stratix V family electrical and switching characteristics and is provided by Intel.

This device is well suited for teams and projects that require consolidation of complex logic into a single programmable device, enabling reduced BOM complexity and tighter system integration while relying on documented device specifications for design and verification.

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