5SGXEA9K2H40I2G

The 5SGXEA9K2H40I2G is a Stratix® V GX family field-programmable gate array (FPGA) in a 1517-BBGA FCBGA package. It delivers high logic density and on-chip memory capacity for demanding, high-integration digital designs.

Key on-chip resources include 840,000 logic elements, approximately 53 Mbits of embedded memory, and 696 general-purpose I/Os. The device is specified for industrial temperature operation and supports core supply voltages in the 870 mV to 930 mV range.

Key Features

• Core Density — 840,000 logic elements to implement large-scale digital logic and complex system functions.
• Embedded Memory — Approximately 53 Mbits of on-chip RAM for buffering, signal processing, and local data storage.
• I/O Capacity — 696 I/Os to support wide bus interfaces, multi-channel connectivity, and dense board-level integration.
• Package & Mounting — 1517-BBGA (FCBGA) package, supplier device package 1517-HBGA (45×45); surface-mount mounting for compact system designs.
• Industrial Temperature Grade — Rated for operation from −40 °C to 100 °C, suitable for deployments that require extended temperature range.
• Low-Voltage Core Supply — Core supply specified from 870 mV to 930 mV to match system power-architecture requirements.
• Standards & Compliance — RoHS-compliant manufacturing status.
• Family Transceiver Capability (Series) — As a Stratix V GX device, the family-level transceiver options include multiple speed grades (series documentation lists GX channel capabilities across speed grades).

Unique Advantages

• High integration density: 840,000 logic elements and ~53 Mbits of embedded memory reduce external component needs and simplify board-level design.
• Large I/O complement: 696 I/Os enable broad peripheral connectivity and multi-channel interfaces without extensive external multiplexing.
• Industrial robustness: −40 °C to 100 °C operating range supports applications that require extended thermal performance.
• Compact, assembly-friendly package: 1517-BBGA FCBGA (45×45 HBGA footprint) provides a high-pin-count solution in a compact form factor for dense PCB layouts.
• Power-aligned core voltage: 870–930 mV core supply range facilitates integration with low-voltage power systems.
• RoHS compliance: Meets RoHS requirements for environmentally responsible designs.

Why Choose 5SGXEA9K2H40I2G?

The 5SGXEA9K2H40I2G positions itself as a high-density Stratix V GX FPGA option for designs that require substantial logic resources, significant embedded memory, and a large I/O footprint in an industrial-temperature-capable device. Its package and power specifications make it suitable for compact, board-dense applications where integration and thermal range are important design constraints.

Engineers selecting this device gain access to Stratix V GX family capabilities while retaining explicit, verifiable specifications for logic capacity, memory, I/O count, package, supply voltage, and operating temperature—supporting confident design trade-offs for complex digital systems.

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