5SGXEA9K2H40I2N

IC FPGA 696 I/O 1517HBGA
Part Description

Stratix® V GX Field Programmable Gate Array (FPGA) IC 696 53248000 840000 1517-BBGA, FCBGA

Quantity 1,309 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package1517-HBGA (45x45)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1517-BBGA, FCBGANumber of I/O696Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs317000Number of Logic Elements/Cells840000
Number of GatesN/AECCN3A001A2CHTS Code8542.39.0001
QualificationN/ATotal RAM Bits53248000

Overview of 5SGXEA9K2H40I2N – Stratix® V GX FPGA, 840,000 logic elements, ~53 Mbits RAM, 696 I/O, 1517-BBGA (FCBGA)

The 5SGXEA9K2H40I2N is a Stratix V GX Field Programmable Gate Array (FPGA) IC in a 1517-BBGA FCBGA package. This industrial-grade device provides a high logic capacity and substantial on-chip memory with a large I/O count for dense, high-functionality designs.

With 840,000 logic elements and approximately 53 Mbits of embedded memory, the device targets industrial applications that require high integration, predictable core voltage operation (870 mV–930 mV), and extended operating temperature support from -40 °C to 100 °C.

Key Features

  • Core / Logic  840,000 logic elements for implementing large-scale logic, DSP, and control functions within a single FPGA.
  • Embedded Memory  Approximately 53 Mbits of on-chip RAM to support buffering, packet storage, and memory-intensive logic blocks.
  • I/O Resources  696 I/O pins to support high-pin-count interfaces and complex board-level connectivity requirements.
  • Power / Voltage  Core supply voltage range of 870 mV to 930 mV for defined power domain planning and supply sequencing.
  • Package & Mounting  1517-BBGA (FCBGA) package, supplier device package 1517-HBGA (45×45), designed for surface-mount PCB assembly.
  • Temperature & Grade  Industrial grade with operating temperature from -40 °C to 100 °C for deployment in demanding environments.
  • Regulatory / Compliance  RoHS compliant to support environmentally constrained designs.

Unique Advantages

  • High integration in a single device: 840,000 logic elements and ~53 Mbits of embedded memory reduce the need for external ASICs or multiple FPGAs in complex designs.
  • Extensive I/O capability: 696 I/O pins enable dense connectivity for multi-channel interfaces and board-level integration.
  • Industrial-grade operation: Specified for -40 °C to 100 °C, suitable for industrial environments that require extended temperature performance.
  • Predictable power domain: Defined core voltage range (870 mV–930 mV) supports clear power-supply design and thermal planning.
  • High-pin-count FCBGA package: The 1517-BBGA package supports compact board layouts while delivering high interconnect density.
  • RoHS compliance: Meets environmental restrictions for lead-free assembly and regulatory conformity.

Why Choose 5SGXEA9K2H40I2N?

The 5SGXEA9K2H40I2N positions itself as a high-capacity, industrial-grade Stratix V GX FPGA suited to designs that demand substantial logic resources, on-chip memory, and a large number of I/O signals in a single surface-mount FCBGA package. Its defined core voltage range and broad operating temperature window offer design predictability and robustness for industrial deployments.

This device is appropriate for engineering teams and procurement seeking a scalable, high-density FPGA platform with clear electrical and environmental specifications and RoHS compliance for long-term product planning and lifecycle support.

Request a quote or submit a quote inquiry to obtain pricing and availability for 5SGXEA9K2H40I2N.

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