5SGXEA9K2H40I3G

The 5SGXEA9K2H40I3G is a Stratix® V GX field programmable gate array (FPGA) in a 1517-ball FCBGA package manufactured by Intel. It delivers high logic density and on-chip memory suitable for designs that require extensive programmable logic, large embedded RAM, and broad I/O connectivity.

This industrial-grade device supports operation from −40 °C to 100 °C and is RoHS compliant, making it appropriate for demanding embedded and industrial systems that require high integration and reliability. Core supply operates between 820 mV and 880 mV.

Key Features

• Core Logic — 840,000 logic elements provide high-density programmable logic for complex designs.
• Logic Array Scale — Approximately 317,000 logic array structures for flexible partitioning and hierarchical design implementation.
• Embedded Memory — Approximately 53.25 Mbits of on-chip RAM to support large buffering, lookup tables, and state storage.
• I/O Capacity — 696 user I/Os to interface with multiple parallel and serial peripherals or mezzanine modules.
• Transceiver Capability (Series-level) — Stratix V GX devices include transceiver speed grades up to 14.1 Gbps for high-speed serial links (series specification).
• Power/Voltage — Core supply voltage range of 820 mV to 880 mV for compatibility with low-voltage core domains.
• Package & Mounting — 1517-BBGA (FCBGA) package; supplier package listed as 1517-HBGA (45×45), surface-mount mounting type for compact system integration.
• Temperature Grade — Industrial grade operation from −40 °C to 100 °C for extended-environment deployments.
• Compliance — RoHS compliant.

Typical Applications

• High-density digital systems — Use the large logic element count and on-chip RAM for complex state machines, signal processing pipelines, and multi-function controllers.
• High-bandwidth connectivity — Leverage Stratix V GX transceiver grades (series-level) and abundant I/Os for high-speed serial links and dense parallel interfaces.
• Industrial embedded control — Industrial temperature rating and extensive I/O make the device suitable for robust control systems and industrial automation equipment.

Unique Advantages

• High logic capacity: 840,000 logic elements enable consolidation of multiple functions into a single device, reducing system-level component count.
• Large embedded memory: Approximately 53.25 Mbits of on-chip RAM supports deep buffering and complex data-path implementations without external memory.
• Extensive I/O: 696 I/Os provide flexibility to connect a wide variety of peripherals and high-pin-count interfaces.
• Industrial operation: Rated from −40 °C to 100 °C to meet the thermal requirements of industrial deployments.
• Compact package: 1517-ball FCBGA (supplier 1517-HBGA 45×45) enables high-density PCB layouts while maintaining surface-mount assembly.
• Standards-compliant manufacturing: RoHS compliance supports regulatory and environmental requirements.

Why Choose 5SGXEA9K2H40I3G?

The 5SGXEA9K2H40I3G positions itself as a high-density, industrial-grade Stratix V GX FPGA that combines substantial programmable logic, sizable on-chip RAM, and broad I/O capability in a compact FCBGA package. Its electrical and thermal specifications support demanding embedded and industrial applications that require integration and reliability.

This device is well suited to design teams building systems that need to consolidate functions, implement high-throughput data paths, or support numerous external interfaces while maintaining industrial temperature operation and RoHS compliance.

To request pricing or submit a quote request for the 5SGXEA9K2H40I3G, please get in touch with our sales channel and request a formal quote referencing the part number.