5SGXEA9K2H40I3LG

The 5SGXEA9K2H40I3LG is an Intel Stratix V GX field programmable gate array (FPGA) supplied in a 1517-BBGA FCBGA package. It delivers very high logic density combined with a large embedded memory and a high I/O count for complex, I/O-intensive designs.

Targeted at industrial temperature applications, this Stratix V GX device is built for designs that require substantial on-chip resources—many logic elements, tens of megabits of RAM, and extensive transceiver and I/O capability—while operating within a low-voltage core supply range.

Key Features

• High logic density — 840,000 logic elements to implement large-scale digital systems and complex custom logic.
• Embedded memory — Approximately 53.25 Mbits of on-chip RAM for buffering, packet processing, or algorithm state storage.
• Extensive I/O — 696 I/O pins to support wide parallel interfaces, multiple peripherals, and dense board connectivity.
• Transceiver and I/O timing — Stratix V GX family electrical and switching characteristics include transceiver specifications and programmable I/O delays suitable for high-speed serial interfaces and precise I/O timing control.
• Low-voltage core — Core voltage supply range from 820 mV to 880 mV for the device core power domain.
• Industrial temperature grade — Rated for operation from –40 °C to 100 °C, supporting industrial-environment deployments.
• Package and mounting — 1517-BBGA (1517-HBGA, 45×45) FCBGA package with surface-mount mounting for high-density PCB integration.
• Standards and compliance — RoHS compliant to meet environmental and manufacturing regulatory expectations.

Typical Applications

• High-speed serial interfaces — Implement transceiver-based links and custom protocol handling using the Stratix V GX family transceiver capabilities and programmable I/O timing.
• Compute and data-path acceleration — Use the large logic capacity and substantial on-chip RAM to offload compute-intensive or streaming data tasks.
• I/O-dense control systems — Leverage 696 I/Os for interfacing to multiple sensors, peripherals, or parallel buses in industrial equipment.

Unique Advantages

• High integration density: 840,000 logic elements reduce the need for multiple devices by consolidating complex functions into a single FPGA.
• Large on-chip memory: Approximately 53.25 Mbits of embedded RAM supports deep buffering and mid-level data storage without external memory.
• Wide I/O capability: 696 I/Os provide flexibility for mixed-signal front ends, parallel interfaces, and board-level partitioning.
• Industrial reliability: –40 °C to 100 °C operating range aligns with industrial deployment requirements for temperature resilience.
• Low-voltage core operation: 820–880 mV supply allows compatibility with low-voltage power architectures and careful power budgeting.
• Surface-mount BBGA package: 1517-BBGA (45×45) FCBGA packaging offers a compact, high-pin-count solution for dense board designs.

Why Choose 5SGXEA9K2H40I3LG?

This Stratix V GX FPGA combines a very large logic fabric with substantial embedded memory and a high I/O count, packaged for surface-mount board integration and rated for industrial-temperature operation. It is suited for designs that require consolidated logic, extensive I/O connectivity, and on-chip buffering while operating within a low-voltage core domain.

Engineers and procurement teams looking to implement high-density FPGA solutions with strong I/O and memory resources will find this device appropriate for complex control, data-path acceleration, and high-speed serial interface applications where industrial temperature performance and RoHS compliance are required.

Request a quote or submit your inquiry to receive pricing and availability information for the 5SGXEA9K2H40I3LG Stratix V GX FPGA.