5SGXEA9K3H40C2G
| Part Description |
Stratix® V GX Field Programmable Gate Array (FPGA) IC 696 53248000 840000 1517-BBGA, FCBGA |
|---|---|
| Quantity | 50 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 26 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1517-HBGA (45x45) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1517-BBGA, FCBGA | Number of I/O | 696 | Voltage | 870 mV - 930 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 317000 | Number of Logic Elements/Cells | 840000 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 53248000 |
Overview of 5SGXEA9K3H40C2G – Stratix® V GX Field Programmable Gate Array (FPGA) IC
The 5SGXEA9K3H40C2G is a Stratix® V GX FPGA from Intel, delivered in a 1517-BBGA FCBGA package. It provides high logic capacity and on-chip memory with a broad complement of I/O, making it suitable for commercial, high-density digital designs.
With 840,000 logic elements, approximately 53.25 Mbits of embedded memory, and up to 696 user I/Os, this device targets high-throughput, high-integration applications that require large programmable logic resources in a single surface-mount package. It is specified for commercial temperature operation (0 °C to 85 °C) and a core voltage supply between 870 mV and 930 mV.
Key Features
- Core Logic: 840,000 logic elements providing extensive programmable logic resources for complex designs.
- Embedded Memory: Approximately 53.25 Mbits of on-chip RAM to support large buffering, state machines, and data-path storage.
- I/O Density: Up to 696 user I/Os to enable wide parallel interfaces and high pin-count connectivity.
- Package & Mounting: 1517-BBGA (FCBGA) package, supplier package 1517-HBGA (45×45), designed for surface-mount assembly.
- Power Supply: Core voltage range of 870 mV to 930 mV to align with platform power designs.
- Operating Grade & Temperature: Commercial grade, specified for 0 °C to 85 °C operation.
- Standards Compliance: RoHS compliant, supporting environmental and regulatory requirements for lead-free assemblies.
- Device Family Characteristics: Part of the Stratix V GX family—device datasheet describes relevant electrical and transceiver characteristics for this family.
Typical Applications
- High-speed communications & networking: Leverage the Stratix V GX family transceiver and logic resources for packet processing, protocol bridging, and line-rate interfaces.
- Data processing and acceleration: Use the large logic capacity and on-chip RAM for custom compute pipelines, packet filtering, and real-time data manipulation.
- Video and broadcast systems: Implement video framing, format conversion, and high-bandwidth data paths using the device’s memory and I/O resources.
- Test, measurement & instrumentation: Build high-channel-count digitizers, data-aggregation engines, and timing-critical measurement logic.
Unique Advantages
- High logic density: 840,000 logic elements enable consolidation of complex functions into a single device, reducing board-level partitioning.
- Substantial embedded memory: Approximately 53.25 Mbits of on-chip RAM supports deep buffering and stateful algorithms without external memory.
- Extensive I/O capability: Up to 696 I/Os allow flexible interface options and high parallel data throughput.
- Commercial-grade deployment: Specified for 0 °C to 85 °C operation, appropriate for a wide range of commercial applications and environments.
- RoHS compliant: Meets lead-free assembly requirements for modern manufacturing processes.
- Compact FCBGA package: 1517-BBGA (45×45 supplier package) provides a high-pin-count solution in a compact surface-mount form factor.
Why Choose 5SGXEA9K3H40C2G?
This Stratix® V GX FPGA balances very large programmable logic capacity, substantial on-chip memory, and high I/O density in a single commercial-grade FCBGA package. It is well suited for designers who need to integrate multiple high-throughput subsystems on one device while maintaining a compact board footprint and compliance with RoHS requirements.
Engineers targeting communication, data processing, video, and test/measurement applications will find the device’s combination of logic, memory, and I/O resources valuable for reducing system complexity and enabling scalable designs within Intel’s Stratix V GX device family.
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