5SGXEA9K3H40C2G

IC FPGA 696 I/O 1517HBGA
Part Description

Stratix® V GX Field Programmable Gate Array (FPGA) IC 696 53248000 840000 1517-BBGA, FCBGA

Quantity 50 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Device Package1517-HBGA (45x45)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1517-BBGA, FCBGANumber of I/O696Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs317000Number of Logic Elements/Cells840000
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits53248000

Overview of 5SGXEA9K3H40C2G – Stratix® V GX Field Programmable Gate Array (FPGA) IC

The 5SGXEA9K3H40C2G is a Stratix® V GX FPGA from Intel, delivered in a 1517-BBGA FCBGA package. It provides high logic capacity and on-chip memory with a broad complement of I/O, making it suitable for commercial, high-density digital designs.

With 840,000 logic elements, approximately 53.25 Mbits of embedded memory, and up to 696 user I/Os, this device targets high-throughput, high-integration applications that require large programmable logic resources in a single surface-mount package. It is specified for commercial temperature operation (0 °C to 85 °C) and a core voltage supply between 870 mV and 930 mV.

Key Features

  • Core Logic: 840,000 logic elements providing extensive programmable logic resources for complex designs.
  • Embedded Memory: Approximately 53.25 Mbits of on-chip RAM to support large buffering, state machines, and data-path storage.
  • I/O Density: Up to 696 user I/Os to enable wide parallel interfaces and high pin-count connectivity.
  • Package & Mounting: 1517-BBGA (FCBGA) package, supplier package 1517-HBGA (45×45), designed for surface-mount assembly.
  • Power Supply: Core voltage range of 870 mV to 930 mV to align with platform power designs.
  • Operating Grade & Temperature: Commercial grade, specified for 0 °C to 85 °C operation.
  • Standards Compliance: RoHS compliant, supporting environmental and regulatory requirements for lead-free assemblies.
  • Device Family Characteristics: Part of the Stratix V GX family—device datasheet describes relevant electrical and transceiver characteristics for this family.

Typical Applications

  • High-speed communications & networking: Leverage the Stratix V GX family transceiver and logic resources for packet processing, protocol bridging, and line-rate interfaces.
  • Data processing and acceleration: Use the large logic capacity and on-chip RAM for custom compute pipelines, packet filtering, and real-time data manipulation.
  • Video and broadcast systems: Implement video framing, format conversion, and high-bandwidth data paths using the device’s memory and I/O resources.
  • Test, measurement & instrumentation: Build high-channel-count digitizers, data-aggregation engines, and timing-critical measurement logic.

Unique Advantages

  • High logic density: 840,000 logic elements enable consolidation of complex functions into a single device, reducing board-level partitioning.
  • Substantial embedded memory: Approximately 53.25 Mbits of on-chip RAM supports deep buffering and stateful algorithms without external memory.
  • Extensive I/O capability: Up to 696 I/Os allow flexible interface options and high parallel data throughput.
  • Commercial-grade deployment: Specified for 0 °C to 85 °C operation, appropriate for a wide range of commercial applications and environments.
  • RoHS compliant: Meets lead-free assembly requirements for modern manufacturing processes.
  • Compact FCBGA package: 1517-BBGA (45×45 supplier package) provides a high-pin-count solution in a compact surface-mount form factor.

Why Choose 5SGXEA9K3H40C2G?

This Stratix® V GX FPGA balances very large programmable logic capacity, substantial on-chip memory, and high I/O density in a single commercial-grade FCBGA package. It is well suited for designers who need to integrate multiple high-throughput subsystems on one device while maintaining a compact board footprint and compliance with RoHS requirements.

Engineers targeting communication, data processing, video, and test/measurement applications will find the device’s combination of logic, memory, and I/O resources valuable for reducing system complexity and enabling scalable designs within Intel’s Stratix V GX device family.

Request a quote or submit an inquiry to receive pricing, availability, and technical assistance for the 5SGXEA9K3H40C2G.

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