5SGXEA9K2H40I3LN

The 5SGXEA9K2H40I3LN is an Intel Stratix V GX field programmable gate array (FPGA) in a 1517-ball FCBGA package. This industrial-grade device provides a high-density logic fabric and on-chip memory suited for systems that require large programmable logic capacity and substantial I/O connectivity.

Key device-level specifications include 840,000 logic elements, approximately 53.2 Mbits of embedded memory, 696 I/O pins, a supply core voltage range of 820 mV to 880 mV, and an operating temperature range of −40 °C to 100 °C. The device is supplied in a surface-mount 1517-BBGA (1517-HBGA / 45 × 45) package.

Key Features

• Core Logic  840,000 logic elements provide large programmable logic capacity for complex digital designs.
• Embedded Memory  Approximately 53.2 Mbits of on-chip RAM to support data buffering, lookup tables, and state storage.
• I/O Density  696 device I/Os enable high-density external interfacing for multi-channel systems and broad peripheral connectivity.
• Package & Mounting  1517-BBGA FCBGA package (supplier package: 1517-HBGA, 45 × 45) with surface-mount mounting for compact board-level integration.
• Power Supply  Core voltage supply range of 820 mV to 880 mV for the device core domain.
• Temperature & Grade  Industrial grade operation rated from −40 °C to 100 °C for deployment in demanding thermal environments.
• Series Transceiver Capability (series-level)  The Stratix V GX family (series documentation) lists transceiver speed-grade options, including GX channel speeds up to 14.1 Gbps in applicable speed grades as described in the device series datasheet.
• Standards & Compliance  RoHS-compliant manufacturing.

Typical Applications

• High‑performance networking and telecom  High I/O count combined with series-level transceiver speed grades supports board designs that require wide parallel interfaces and high-speed serial links.
• Compute acceleration and signal processing  Large logic capacity and substantial on-chip RAM enable implementation of complex compute kernels and DSP pipelines.
• Industrial control and instrumentation  Industrial temperature rating and extensive I/O make the device suitable for control systems and industrial instrumentation requiring robust operation across wide temperatures.
• High-density system integration  The 1517‑ball FCBGA package and surface-mount profile support compact, high-density PCB layouts for integrated systems and subsystems.

Unique Advantages

• Large programmable fabric  840,000 logic elements let designers map complex state machines, accelerators, and custom logic without external devices.
• Significant on-chip memory  Approximately 53.2 Mbits of embedded RAM reduces dependence on external memory for buffering and on-chip data structures.
• High I/O count  696 I/Os allow wide parallel buses, multiple peripheral interfaces, and extensive board-level connectivity.
• Industrial temperature operation  Rated from −40 °C to 100 °C for reliable performance in temperature-challenging deployments.
• Compact, surface-mount package  1517-BBGA (1517-HBGA, 45 × 45) package provides high integration density in a board-assembly friendly form factor.
• Series-level transceiver options  Stratix V GX series documentation describes transceiver speed grades up to 14.1 Gbps, supporting designs that require high-speed serial channels (see series datasheet for grade details).

Why Choose 5SGXEA9K2H40I3LN?

This Stratix V GX device combines large logic capacity, substantial embedded memory, and high I/O density in an industrial-grade FPGA package. It targets designs that require scalable programmable logic, extensive on-chip resources, and robust operation across a wide temperature range.

Choose 5SGXEA9K2H40I3LN when your project demands significant on-chip logic and memory resources, a high count of external interfaces, and industrial temperature performance backed by the Stratix V series device documentation.

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