5SGXEA9K2H40I3L

The 5SGXEA9K2H40I3L is a Stratix V GX field programmable gate array (FPGA) IC designed for high-density programmable logic integration. It combines 840,000 logic elements with large on-chip memory and a high I/O count to support complex, compute- and I/O-intensive designs.

Offered in an industrial temperature grade with specified core supply voltage and BGA packaging, the device targets applications requiring high logic capacity, substantial embedded memory, and high-speed serial transceiver capability as defined in the Stratix V GX family specification.

Key Features

• Logic Capacity 840,000 logic elements to implement large-scale programmable logic and complex finite-state machines.
• Embedded Memory Approximately 53.25 Mbits of on-chip RAM for buffering, lookup tables, and state storage.
• I/O Density 696 user I/O pins to support wide parallel interfaces and high pin-count system integration.
• High-speed Transceivers (Stratix V GX family) Stratix V GX devices include transceiver speed grades referenced in the device family documentation (GX channel speed grades up to 14.1 Gbps in relevant grades).
• Power and Core Voltage Specified core voltage range of 820 mV to 880 mV for core power planning and supply design.
• Package & Mounting 1517-BBGA (FCBGA) package with supplier device package listed as 1517-HBGA (45×45); surface-mount mounting type for standard PCB assembly.
• Temperature & Grade Industrial grade device with an operating temperature range of −40 °C to 100 °C for robust environmental performance.
• Regulatory RoHS-compliant material status.

Typical Applications

• High-density programmable logic — Implement large-scale custom logic, control, and glue-logic functions requiring extensive logic elements and embedded memory.
• High-speed serial connectivity — Leverage Stratix V GX transceiver speed grades for systems that require high-bandwidth serial lanes (refer to device family speed-grade tables for supported lane rates).
• Data buffering and packet processing — Use the large on-chip RAM capacity for multi-channel buffering, packet queues, and memory-intensive stream processing.

Unique Advantages

• High logic density: 840,000 logic elements provide capacity for complex, multi-function FPGA designs without external glue logic.
• Substantial on-chip memory: Approximately 53.25 Mbits of embedded RAM reduces reliance on external memory for many buffering and caching needs.
• Extensive I/O: 696 I/O pins enable broad connectivity and parallel interfacing to peripherals and high-pin-count mezzanine modules.
• Industrial temperature rating: −40 °C to 100 °C operating range supports deployment in harsher environments where extended temperature tolerance is required.
• BGA package for high pin-count designs: 1517-BBGA (45×45 supplier package) supports dense routing and high signal-count system implementations.
• RoHS-compliant: Meets common lead-free material requirements for modern manufacturing processes.

Why Choose 5SGXEA9K2H40I3L?

The 5SGXEA9K2H40I3L positions itself as a high-capacity Stratix V GX FPGA for designs that demand a large pool of logic resources, significant embedded memory, and extensive I/O. Its industrial temperature rating and BGA packaging make it suitable for systems requiring robustness and high integration density.

Engineers and procurement teams looking for scalable, enterprise-class FPGA silicon with documented Stratix V GX family electrical and transceiver characteristics can rely on the clear, verifiable specifications—logic elements, on-chip RAM, I/O count, voltage range, and operating temperature—when planning power, thermal, and PCB integration.

If you would like pricing, availability, or to request a formal quotation for the 5SGXEA9K2H40I3L, submit a request to our sales team and include your required quantities and delivery schedule for a prompt response.