5SGXEA9K2H40I3N

The 5SGXEA9K2H40I3N is an Intel Stratix® V GX field programmable gate array (FPGA) in a 1517-ball BGA package designed for industrial applications. It provides a high density of programmable logic, abundant on-chip RAM, and extensive I/O to support complex system integration and high-performance designs.

Targeted use cases include high-channel digital processing, complex protocol bridging, and system-level integration where large logic capacity, substantial embedded memory, and robust I/O counts are required.

Key Features

• Core FPGA Architecture  Stratix V GX family FPGA architecture provided in the 5SGXEA9K2H40I3N part.
• Logic Capacity  840,000 logic elements enabling implementation of large-scale digital designs.
• Logic Blocks  317,000 logic array blocks for structured logic partitioning and resource mapping.
• Embedded Memory  Approximately 53 Mbits of on-chip RAM for buffering, FIFOs, and embedded data storage.
• I/O Resources  696 user I/Os to support extensive peripheral and high-pin-count interfaces.
• Power Supply  Core supply operating between 820 mV and 880 mV for defined power domain requirements.
• Package & Mounting  1517-BBGA (FCBGA) package, supplier device package listed as 1517-HBGA (45×45); surface-mount device.
• Industrial Temperature Grade  Rated for operation from –40 °C to 100 °C suitable for industrial environments.
• Compliance  RoHS compliant.

Typical Applications

• High-performance signal processing  Large logic capacity and substantial on-chip RAM support complex DSP pipelines and parallel processing tasks.
• Communications and protocol bridging  High I/O count enables interfacing with dense multi-channel link arrays and protocol converters.
• System integration platforms  Combines logic density and memory to consolidate multiple subsystems into a single FPGA-based design.
• Industrial control and automation  Industrial temperature grade and robust package options fit demanding factory and process-control environments.

Unique Advantages

• High-density programmable logic: 840,000 logic elements provide room for large designs and complex state machines without immediate need for multiple devices.
• Substantial embedded memory: Approximately 53 Mbits of on-chip RAM enables large buffers and local data storage for low-latency processing.
• Extensive I/O availability: 696 I/Os allow flexible interfacing to multiple peripherals, sensors, transceivers, and board-level connections.
• Industrial operating range: –40 °C to 100 °C rating supports deployment in temperature-challenging industrial environments.
• Compact BGA packaging: 1517-ball BGA (45×45 supplier package) supports high-pin-count designs in a manageable PCB footprint.
• Standards compliance: RoHS compliance supports regulatory and environmental requirements.

Why Choose 5SGXEA9K2H40I3N?

The 5SGXEA9K2H40I3N positions itself as a high-density Stratix V GX FPGA option for engineers needing extensive logic resources, significant embedded memory, and a large number of I/Os in an industrial-grade package. Its core voltage range, thermal rating, and BGA footprint make it suitable for integrated, high-complexity designs where on-chip capacity and reliable operation across temperatures are required.

Designers and procurement teams can rely on its combination of logic scale, memory, and I/O to consolidate functionality, reduce board-level complexity, and support scalable system designs within industrial environments.

Request a quote or submit a purchase inquiry through your preferred procurement channel to evaluate 5SGXEA9K2H40I3N for your next design project.