5SGXEA9K2H40I2LG

The 5SGXEA9K2H40I2LG is an Intel Stratix® V GX field programmable gate array (FPGA) offered in an industrial temperature grade and a high-density FCBGA package. With 840,000 logic elements and approximately 53 Mbits of embedded memory, this device targets designs that require substantial on-chip logic, large memory resources, and dense I/O integration.

Key deployment areas include high-performance digital processing, advanced networking and communications, and industrial systems that benefit from wide operating temperature range and a large I/O count. The device’s low core supply range and surface-mount FCBGA package support compact, high-density board designs.

Key Features

• Core Logic  840,000 logic elements supporting complex digital implementations and high-density designs.
• Logic Array Blocks (LABs)  317,000 LABs for structured logic partitioning and resource organization.
• Embedded Memory  Approximately 53 Mbits of on-chip RAM to support buffering, FIFOs, and embedded data storage.
• I/O Capacity  696 I/O pins to enable broad connectivity for parallel interfaces, buses, and high-pin-count systems.
• Power and Core Supply  Core voltage range of 820 mV to 880 mV to match low-voltage power domains and optimize power delivery.
• Package and Mounting  Surface-mount 1517-BBGA (FCBGA) package; supplier device package listed as 1517-HBGA (45×45) for high-density PCB integration.
• Temperature and Grade  Industrial-grade operation from −40 °C to 100 °C suitable for demanding ambient environments.
• RoHS Compliant  Conforms to RoHS environmental requirements.

Typical Applications

• High‑Performance Signal Processing  Implement large-scale digital filters, encoders/decoders, and real‑time processing pipelines using abundant logic and memory resources.
• Networking & Communications  Support complex packet processing, protocol offload, and multi‑lane interfaces with 696 I/O pins and Stratix V GX family capabilities.
• Industrial Automation & Control  Deploy in control systems that require industrial temperature operation and robust on‑chip resources for deterministic logic.
• Test & Measurement Systems  Build high‑channel-count acquisition, preprocessing, and pattern generation systems leveraging the device’s logic density and I/O.

Unique Advantages

• High Logic Density:  840,000 logic elements enable large, consolidated designs and reduce the need for multiple FPGAs.
• Substantial On‑Chip Memory:  Approximately 53 Mbits of embedded RAM minimizes external memory dependency for buffering and state storage.
• Extensive I/O Count:  696 I/Os provide flexibility for parallel interfaces, wide data buses, and complex board-level integration.
• Industrial Temperature Range:  Rated from −40 °C to 100 °C for deployment in harsh or temperature-variable environments.
• Compact, High‑Density Package:  1517-BBGA FCBGA (supplier 1517-HBGA 45×45) supports space-constrained layouts while maintaining high pin density.
• Low Core Voltage Operation:  Core supply between 820 mV and 880 mV enables designs optimized for low-voltage power domains.

Why Choose 5SGXEA9K2H40I2LG?

The 5SGXEA9K2H40I2LG combines very high logic capacity, significant on‑chip memory, and a large I/O complement in an industrial-grade Stratix V GX FPGA package. It is well suited for engineers and system architects who need to consolidate complex digital functions, accelerate data‑intensive processing, or implement high-bandwidth interfaces within a compact surface-mount footprint.

For designs requiring scalability, robust temperature performance, and a high level of integration, this Stratix V GX device provides verifiable resources and package options to support long-term deployment and system-level reliability.

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