5SGXEA9K2H40C3G

The 5SGXEA9K2H40C3G is an Intel Stratix® V GX field-programmable gate array packaged in a 1517-BBGA FCBGA. It delivers large programmable logic capacity and high I/O density for complex digital designs.

With 840,000 logic elements and approximately 53 Mbits of embedded memory, this device is aimed at applications that require substantial on-chip resources, high pin count, and a compact BGA footprint while operating within commercial temperature conditions.

Key Features

• Core Logic  840,000 logic elements and 317,000 logic-array resources (as specified) provide extensive programmable fabric for large designs.
• Embedded Memory  Approximately 53 Mbits of on-chip RAM (53,248,000 bits) to support buffering, state machines, and memory-intensive functions.
• I/O Capacity  696 device I/Os enable high-density interfacing to peripherals, mezzanine cards, and multi-lane systems.
• Power  Core voltage supply specified between 820 mV and 880 mV for the programmable logic core.
• Package & Mounting  1517-BBGA (FCBGA) package; supplier device package listed as 1517-HBGA (45×45). Device is surface-mountable.
• Operating Conditions  Commercial grade with an operating temperature range of 0°C to 85°C.
• Compliance  RoHS-compliant manufacturing.

Typical Applications

• High-density digital processing  Large programmable logic and on-chip RAM make this device suitable for compute-intensive FPGA tasks and custom accelerator functions.
• Memory-intensive architectures  Approximately 53 Mbits of embedded memory supports buffering, FIFOs, and multi-stage pipelines within a single device.
• High-pin-count systems  696 I/Os enable connectivity for systems that require many external interfaces, multi-board interconnects, or dense peripheral routing.
• Compact, board-level integration  The 1517-BBGA FCBGA package and surface-mount mounting support compact, high-density PCB designs.

Unique Advantages

• High logic capacity: 840,000 logic elements allow implementation of large, complex designs without immediate need for multiple devices.
• Substantial on-chip memory: Approximately 53 Mbits of embedded RAM reduces dependence on external memory for many designs.
• Extensive I/O resources: 696 I/Os simplify board-level connectivity and reduce the need for external multiplexing.
• Low-voltage core: Specified core supply between 820 mV and 880 mV supports designs targeting modern low-voltage FPGA cores.
• Compact BGA package: 1517-BBGA (supplier package 1517-HBGA, 45×45) provides a high-pin-count solution in a space-efficient footprint.
• Commercial temperature rating: Rated for 0°C to 85°C operation to match standard commercial product requirements.

Why Choose 5SGXEA9K2H40C3G?

The 5SGXEA9K2H40C3G balances very large programmable logic capacity, substantial embedded memory, and a high I/O count in a compact FCBGA package. It is suited to designs that demand on-chip resources and dense external connectivity while operating within commercial temperature limits.

As a member of the Stratix V GX family from Intel, this device is documented within the Stratix V device literature and is intended for engineers and procurement teams building high-density FPGA-based systems.

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