5SGXEA9K2H40C2L

The 5SGXEA9K2H40C2L is an Intel Stratix® V GX field programmable gate array (FPGA) offered in a 1517-BBGA FCBGA package. It provides a high-density programmable logic fabric with 840,000 logic elements, approximately 53.25 Mbits of embedded memory, and 696 user I/Os for complex digital integration.

Designed as a commercial-grade device, this Stratix V GX FPGA targets applications that require large logic capacity, significant on-chip RAM, and a high I/O count within a surface-mount 1517-HBGA (45×45) footprint. The device operates from a core voltage range of 820 mV to 880 mV and across a commercial operating temperature range of 0°C to 85°C.

Key Features

• Core Logic  840,000 logic elements supporting large-scale programmable logic implementations.
• Embedded Memory  Approximately 53.25 Mbits of on-chip RAM to support data buffering, FIFOs, and memory-intensive logic blocks.
• I/O Density  696 available I/Os for high-pin-count interface integration and multi-channel system connectivity.
• Package & Mounting  1517-BBGA (FCBGA) package; supplier device package listed as 1517-HBGA (45×45). Surface-mount mounting type.
• Power  Core supply voltage specified between 820 mV and 880 mV for the device core domain.
• Commercial Grade & Temperature  Commercial temperature grade with an operating range of 0°C to 85°C.
• Compliance  RoHS compliant for environmental and manufacturing requirements.

Typical Applications

• Large-scale programmable logic  Implement complex system functions where high logic density and substantial embedded memory are required.
• High-pin-count interface aggregation  Consolidate multiple parallel and serial interfaces using the device’s 696 I/Os for board-level I/O consolidation.
• SoC prototyping and hardware acceleration  Use the extensive logic elements and on-chip RAM to prototype and accelerate compute-intensive IP blocks.
• Memory-intensive data buffering  Leverage the embedded RAM to implement large FIFOs, packet buffering, or on-chip scratchpad memory.

Unique Advantages

• Very high logic capacity: 840,000 logic elements enable integration of large digital subsystems on a single FPGA device, reducing external component count.
• Significant embedded RAM: Approximately 53.25 Mbits of on-chip memory supports data-heavy designs without immediate dependence on external memory.
• Extensive I/O resources: 696 I/Os simplify interfacing to multiple peripherals, mezzanine cards, or board-level connectors.
• Compact, surface-mount BGA package: 1517-HBGA (45×45) footprint balances high integration density with board-level routing and assembly requirements.
• Commercial operating range: Rated for 0°C to 85°C operation to match standard commercial product deployment environments.
• Regulatory compliance: RoHS compliance supports modern manufacturing and environmental requirements.

Why Choose 5SGXEA9K2H40C2L?

The 5SGXEA9K2H40C2L positions itself as a high-density Stratix V GX FPGA option for designs that demand large programmable logic capacity, substantial on-chip memory, and a high number of I/Os within a compact surface-mount BGA package. Its commercial-grade temperature range and RoHS compliance make it suitable for mainstream electronic products and complex prototyping efforts.

Engineers and teams that need to consolidate logic, buffer data on-chip, and integrate numerous external interfaces will find the device’s resource mix aligned to those goals. Backed by Stratix V device documentation and Intel’s device family resources, this FPGA is intended for scalable designs requiring significant logic and memory resources in a single package.

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