5SGXEA7N3F45I3LN

The 5SGXEA7N3F45I3LN is a Stratix V GX family FPGA device offering high logic density and extensive I/O capability in a 1932-ball FCBGA package. It combines a large pool of programmable logic, substantial on-chip RAM, and industrial temperature grading to address demanding embedded and communications applications.

Documented in the Stratix V device datasheet, the family includes GX transceiver speed grades and industrial operating options. This device is targeted where high gate count, large embedded memory, and a high pin count are required under industrial temperature ranges.

Key Features

• Logic Capacity — 622,000 logic elements to implement complex custom logic and high-density designs.
• Embedded Memory — Approximately 51.2 Mbits of on-chip RAM for buffering, lookup tables, and state storage.
• I/O Resources — 840 user I/O pins to support wide parallel interfaces and extensive peripheral connectivity.
• Package and Mounting — 1932-BBGA (FCBGA) supplier package 1932-FBGA, FC (45×45); surface-mount package for compact board-level integration.
• Power and Voltage — Core supply range 820 mV to 880 mV for compatibility with the Stratix V core power envelope.
• Temperature Grade — Industrial operating range from −40°C to 100°C for deployment in temperature-demanding environments.
• RoHS Compliant — Meets RoHS environmental requirements.

Typical Applications

• High‑speed communications — The Stratix V family documentation includes GX transceiver speed-grade options; this device’s high I/O and family capabilities suit networking and link aggregation applications requiring extensive parallel and serial interfacing.
• Signal processing and compute acceleration — Large logic element count and substantial embedded RAM enable custom DSP pipelines, packet processing, and hardware-accelerated algorithms.
• Industrial and embedded systems — Industrial temperature rating and robust package make the device suitable for control systems, industrial automation, and instrumentation where extended temperature operation is required.

Unique Advantages

• High logic density: 622,000 logic elements provide the capacity to consolidate complex custom functions into a single device, reducing BOM and board complexity.
• Significant on‑chip memory: Approximately 51.2 Mbits of embedded RAM supports large buffering, state machines, and table storage without external memory.
• Extensive I/O: 840 I/O pins allow broad peripheral and parallel interface support, enabling flexible board-level partitioning and connectivity.
• Industrial temperature operation: Rated −40°C to 100°C for reliable operation in temperature-challenging deployments.
• Compact, high-pin-count package: 1932-ball FCBGA (45×45) packaging provides a high I/O density in a single, surface-mount footprint.
• Standards-aligned documentation: Backed by Stratix V family device datasheet material from the device vendor for electrical and switching characteristics.

Why Choose 5SGXEA7N3F45I3LN?

The 5SGXEA7N3F45I3LN positions itself for designs that require substantial programmable logic, large embedded memory resources, and a high number of I/O in an industrial-grade FPGA. Its combination of 622,000 logic elements, approximately 51.2 Mbits of on-chip RAM, and 840 I/Os delivers a capable platform for consolidating complex digital functions and high-throughput interfaces into a single device.

This device is well suited to engineering teams developing industrial, communications, or compute-accelerated systems that need a validated Stratix V GX family solution with documented electrical characteristics and defined operating parameters.

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