5SGXEA7N3F45I3G

The 5SGXEA7N3F45I3G is an industrial-grade Stratix V GX Field Programmable Gate Array (FPGA) in a 1932-BBGA FCBGA package. It provides a high-density programmable fabric with 622,000 logic elements and approximately 51.2 Mbits of embedded RAM, combined with a large I/O count for complex, pin-intensive designs.

Designed for applications that require substantial on-chip logic, memory and I/O capacity, this Stratix V GX device offers tight power-supply windows and extended operating temperature support suitable for demanding embedded and industrial environments.

Key Features

• Core and logic — 622,000 logic elements to implement large-scale custom logic and complex processing pipelines.
• Embedded memory — Approximately 51.2 Mbits of on-chip RAM for buffering, FIFOs, and on-die data storage without external memory.
• I/O capacity — 840 I/O pins to support high-pin-count interfaces, parallel buses, and multiple external peripherals.
• Power supply — Core supply range of 820 mV to 880 mV for defined power-domain design and stable operation.
• Package and mounting — 1932-BBGA (FCBGA) supplier package (1932-FBGA, FC 45×45) with surface-mount mounting for high-density board designs.
• Industrial temperature grade — Rated for operation from −40 °C to 100 °C for use in temperature-challenging environments.
• Standards and compliance — RoHS compliant for environmental and regulatory conformance.

Typical Applications

• High-density custom logic — Implement large, application-specific processing engines where extensive programmable logic and embedded memory are required.
• High-pin-count interface aggregation — Consolidate and manage multiple parallel interfaces or complex I/O routing using the device’s 840 I/O pins.
• Embedded system acceleration — Offload compute-intensive or latency-sensitive tasks to on-chip logic and RAM to reduce external component count and latency.

Unique Advantages

• Substantial on-chip resources: 622,000 logic elements and approximately 51.2 Mbits of embedded RAM enable large designs without immediate reliance on external memory.
• Extensive I/O flexibility: 840 I/Os support complex board-level integration and multiple simultaneously connected peripherals or interfaces.
• Industrial robustness: Industrial temperature rating (−40 °C to 100 °C) extends deployment options into harsher environments.
• Compact, high-density package: 1932-BBGA (FCBGA) 45×45 supplier package supports high pin counts in a compact footprint for space-constrained designs.
• Controlled core power domain: Narrow core voltage range (820 mV–880 mV) aids predictable power budgeting and thermal design.
• Regulatory readiness: RoHS compliance supports environmentally conscious production and procurement requirements.

Why Choose 5SGXEA7N3F45I3G?

The 5SGXEA7N3F45I3G positions itself as a high-density Stratix V GX FPGA suited to designs that demand large programmable logic capacity, significant embedded memory, and extensive I/O connectivity within an industrial temperature envelope. Its combination of logic resources, on-chip RAM and high pin count simplifies system integration for complex digital workloads.

This device is appropriate for engineering teams building scalable, robust electronic systems that require deterministic on-die resources and a compact, high-pin-count package. The industrial-grade temperature range and RoHS compliance add to long-term deployment flexibility and regulatory alignment.

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