5SGXEA7N3F45C4G

The 5SGXEA7N3F45C4G is a Stratix® V GX Field Programmable Gate Array (FPGA) IC from Intel, delivering a high-density programmable fabric in a 1932-ball FCBGA package. With 622,000 logic elements, abundant embedded RAM, and a large I/O count, this device is intended for complex digital systems requiring extensive logic, memory, and connectivity.

This commercial-grade FPGA (0 °C to 85 °C) targets applications that need large-scale logic integration, substantial on-chip memory, and high I/O density while operating from a low core supply range (820 mV to 880 mV).

Key Features

• Large Logic Capacity  Provides 622,000 logic elements to implement complex datapaths, state machines, and custom accelerators.
• Embedded Memory  Approximately 51.2 Mbits of on-chip RAM to support large buffers, FIFOs, and memory-intensive algorithms without external memory for many use cases.
• High I/O Density  840 user I/O pins enable rich peripheral connectivity and dense board-level integration for multi-channel designs.
• Package & Mounting  1932-BBGA (FCBGA) package, supplier package listed as 1932-FBGA, FC (45×45); surface-mount mounting for compact, high-density PCB layouts.
• Power and Core Voltage  Core supply operating range of 820 mV to 880 mV for designs requiring modern low-voltage FPGA cores.
• Commercial Temperature Grade  Rated for 0 °C to 85 °C operating temperature for standard commercial applications.
• Standards and Compliance  RoHS compliant to meet contemporary environmental requirements.
• Stratix V GX Family Transceiver Capability  As part of the Stratix V GX family, device-level datasheet defines high-speed transceiver speed grades in the family specification.

Typical Applications

• High-density Digital Processing  Use the large logic element count to implement complex signal processing, protocol stacks, or compute accelerators entirely in programmable logic.
• Memory-Intensive Designs  Approximately 51.2 Mbits of embedded RAM supports large on-chip buffers, packet processing, and data staging without relying solely on external memory.
• Multi-channel I/O Systems  With 840 I/O pins, the device suits designs requiring many parallel interfaces such as multi-lane data acquisition, test instrumentation, and communication aggregators.

Unique Advantages

• Massive Programmable Fabric: 622,000 logic elements provide headroom for large, integrated designs, reducing the need for multiple FPGAs.
• Substantial On-Chip Memory: Approximately 51.2 Mbits of RAM minimizes external memory dependence for many buffering and processing tasks, simplifying board design.
• High I/O Count: 840 I/Os enable direct connections to numerous peripherals and high-pin-count interfaces without extensive external multiplexing.
• Compact, Industry-standard Package: 1932-BBGA (FCBGA) supports dense PCB routing while maintaining compatibility with surface-mount assembly processes.
• Commercial Temperature Support: Rated 0 °C to 85 °C to match commercial product requirements and environments.
• Manufacturer Backing: Built on the Stratix V GX family architecture from Intel, supported by family-level electrical and switching characteristic specifications in the device datasheet.

Why Choose 5SGXEA7N3F45C4G?

The 5SGXEA7N3F45C4G combines a very large logic fabric, significant on-chip memory, and high I/O density in a compact FCBGA package—making it suitable for demanding commercial designs that require integration of complex functions into a single device. Its operating voltage range and RoHS compliance align with modern system power and environmental requirements.

This part is ideal for engineering teams developing advanced digital systems that need scalable programmable resources, substantial embedded memory, and extensive connectivity while leveraging the Stratix V GX family specification and Intel’s device documentation for design planning and validation.

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