5SGXEA7N3F45C3N

The 5SGXEA7N3F45C3N is a Stratix V GX family field-programmable gate array (FPGA) device offering very high logic density and a large I/O complement in a high-pin-count FCBGA package. It targets commercial designs that require substantial on-chip memory, extensive programmable logic, and high I/O capacity.

Built for surface-mount assembly and commercial temperature operation, this device provides a combination of core resources and system integration suitable for complex programmable logic implementations.

Key Features

• High logic capacity — 622,000 logic elements capable of implementing large-scale programmable logic designs.
• Embedded memory — approximately 51.2 Mbits of on-chip RAM for data buffering, FIFOs, and memory-intensive logic.
• Extensive I/O — 840 general-purpose I/O pins to support wide parallel interfaces and dense connectivity requirements.
• Low-voltage core — core supply range specified at 820 mV to 880 mV for the device core.
• Package and mounting — supplied in a 1932-BBGA (FCBGA) package; supplier device package listed as 1932-FBGA, FC (45×45). Surface-mount mounting type.
• Commercial temperature grade — rated for operation from 0 °C to 85 °C appropriate for commercial applications.
• Environmental compliance — RoHS compliant.

Typical Applications

• High-density programmable logic — designs that require hundreds of thousands of logic elements for complex custom algorithms and data processing.
• I/O-intensive systems — systems that need large numbers of parallel interfaces or extensive signal routing, leveraging the 840 I/O pins.
• Memory-centric designs — applications that benefit from substantial on-chip RAM (≈51.2 Mbits) for buffering, packet storage, or embedded data structures.
• Commercial electronic equipment — products and instruments designed to operate within the 0 °C to 85 °C commercial temperature range.

Unique Advantages

• High integration density: 622,000 logic elements reduce external logic and enable large functions to be implemented on a single device.
• Significant embedded memory: approximately 51.2 Mbits of RAM supports on-chip buffering and state storage without relying on external memory.
• Massive I/O capability: 840 I/O pins provide flexibility for wide buses, multiple interfaces, and extensive signal routing.
• Compact FCBGA packaging: 1932-ball BGA (45×45 mm supplier package) allows a high-pin-count device in a surface-mount form factor.
• Optimized core voltage: 820 mV–880 mV supply range aligns with modern low-voltage core requirements.
• RoHS compliant: meets environmental compliance requirements for lead-free assembly and regulatory needs.

Why Choose 5SGXEA7N3F45C3N?

The 5SGXEA7N3F45C3N delivers a strong combination of logic capacity, embedded memory, and I/O resources in a single commercial-grade Stratix V GX FPGA. Its specification set makes it suitable for complex programmable designs where on-chip resources and high I/O counts are primary design drivers.

This device is well suited to development teams and OEMs building systems that require scalable programmable logic, substantial on-chip RAM, and dense connectivity while operating within commercial temperature limits. Its package and electrical specs support integration into surface-mount, high-density board designs.

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