5SGXEA7N3F45C2

The 5SGXEA7N3F45C2 is a Stratix V GX Field Programmable Gate Array (FPGA) IC that delivers large logic capacity and substantial on-chip memory in a high-pin-count BGA package. It is targeted at designs that require extensive logic resources, high I/O counts, and integrated memory for complex digital processing.

With 622,000 logic elements, approximately 51.2 Mbits of embedded RAM, and 840 I/Os, this commercial-grade Stratix V GX device suits high-density digital systems and communications applications where core logic capacity, I/O bandwidth, and package integration matter.

Key Features

• Logic Capacity — 622,000 logic elements provide substantial programmable logic for complex implementations and large-scale designs.
• Embedded Memory — Approximately 51.2 Mbits of on-chip RAM to support buffering, large FIFOs, and memory-intensive logic functions.
• I/O and Connectivity — 840 available I/Os for extensive external interfacing and system-level connectivity.
• Transceiver Capability (Stratix V GX) — Device belongs to the Stratix V GX family with high-speed transceiver support as described in the Stratix V device datasheet.
• Power Supply — Core voltage range specified at 870 mV to 930 mV for controlled power provisioning.
• Package & Mounting — 1932-BBGA (FCBGA) package; supplier device package listed as 1932-FBGA, FC (45x45). Surface-mount mounting type.
• Temperature & Grade — Commercial grade device rated for 0 °C to 85 °C operating temperature range.
• Regulatory — RoHS compliant.

Typical Applications

• High‑performance communications — Stratix V GX transceiver capability and high I/O count support demanding link interfaces and protocol processing.
• Data processing and acceleration — Large logic capacity and substantial embedded RAM enable complex packet, signal, or algorithmic processing pipelines.
• System integration and I/O aggregation — High pin count BGA package and 840 I/Os simplify integration of multiple peripherals and external interfaces on a single device.

Unique Advantages

• Large programmable fabric: 622,000 logic elements let you implement highly parallel architectures and dense logic functions without partitioning across multiple devices.
• Significant on‑chip memory: Approximately 51.2 Mbits of embedded RAM reduces reliance on external memory for buffering and state storage, simplifying board-level design.
• Extensive I/O: 840 I/Os provide flexibility to connect numerous external devices, peripherals, and high-speed interfaces directly to the FPGA.
• High-density package: 1932-BBGA (FCBGA) packaging supports high pin-count routing in a single surface-mount component, aiding compact board layouts.
• Commercial temperature rating: Specified for 0 °C to 85 °C operation to match a wide range of commercial electronic applications.
• RoHS compliant: Meets RoHS environmental requirements for lead-free assembly and regulatory compliance.

Why Choose 5SGXEA7N3F45C2?

The 5SGXEA7N3F45C2 delivers a combination of high logic density, substantial embedded memory, and a large I/O count in a 1932-ball BGA package, making it suitable for complex digital designs that require consolidated functionality and extensive interfacing. As a Stratix V GX device, it aligns with the family-level specifications for transceiver-capable FPGAs.

This device is well suited for engineering teams designing high-density communication systems, compute accelerators, or integrated platform solutions where on-chip resources and I/O capacity translate directly into reduced board complexity and streamlined designs.

Request a quote or submit a purchase inquiry to receive pricing, availability, and lead-time information for the 5SGXEA7N3F45C2 Stratix V GX FPGA.