5SGXEA7N3F40I4G

The 5SGXEA7N3F40I4G is an Intel Stratix V GX field-programmable gate array (FPGA) in a 1517‑BBGA FCBGA package. It integrates approximately 622,000 logic elements and approximately 51.2 Mbits of embedded memory with up to 600 I/Os for high-density programmable logic designs.

Specified for industrial use, this device supports a supply voltage range of 820 mV to 880 mV and an operating temperature range of –40 °C to 100 °C, and is supplied as a surface-mount 1517‑FBGA (40×40) package. RoHS compliance is included.

Key Features

• Logic Capacity  Approximately 622,000 logic elements for large, complex FPGA designs.
• Embedded Memory  Approximately 51.2 Mbits of on-chip RAM to support buffering, LUTs, and state storage without external memory.
• I/O Density  Up to 600 I/Os to connect to numerous peripherals, sensors, and high-pin-count interfaces.
• Power and Core Supply  Core supply specified between 820 mV and 880 mV to align with system power-rail planning.
• Package & Mounting  1517‑BBGA, FCBGA package; supplier device package 1517‑FBGA (40×40); surface-mount for board-level integration.
• Industrial Temperature Grade  Rated for –40 °C to 100 °C operation for deployment in temperature-variable environments.
• Standards Compliance  RoHS compliant for regulatory and manufacturing requirements.

Typical Applications

• Industrial Control & Automation  Industrial temperature rating and high I/O count support control systems and I/O-heavy automation tasks.
• High-density Logic Implementation  Large logic element count and substantial embedded RAM enable complex logic, custom processing, and hardware acceleration.
• Prototyping and System Integration  Surface-mount FCBGA packaging and extensive I/O make the device suited for integration into compact development and production boards.

Unique Advantages

• Highly scalable logic capacity: The approximately 622,000 logic elements allow consolidation of multiple functions into a single device, reducing system complexity.
• Substantial on-chip memory: Approximately 51.2 Mbits of embedded RAM reduces dependence on external memory for buffering and intermediate storage.
• Extensive I/O availability: Up to 600 I/Os provide flexible connectivity for diverse peripherals and high-pin-count interfaces.
• Industrial temperature support: –40 °C to 100 °C rating enables deployment in harsher thermal environments common in industrial applications.
• Compact, board-ready package: The 1517‑FBGA (40×40) surface-mount package supports dense PCB layouts and standard assembly processes.
• Regulatory compliance: RoHS compliance streamlines adoption into environmentally regulated product lines.

Why Choose 5SGXEA7N3F40I4G?

The 5SGXEA7N3F40I4G positions itself for designs that require a combination of high programmable-logic density, significant on-chip memory, and a large number of I/Os, delivered in an industrially rated FCBGA package. Its specified supply-voltage window and temperature range support integration into robust, production-grade systems.

Engineers and procurement teams evaluating mid-to-high density Stratix V GX devices will find this part well suited for consolidated system designs where embedded memory, I/O capacity, and industrial environmental tolerance are primary selection criteria.

Request a quote or submit an inquiry to learn more about availability, lead times, and how this device can fit your next design.