5SGXEA7N3F45C2L

IC FPGA 840 I/O 1932FBGA
Part Description

Stratix® V GX Field Programmable Gate Array (FPGA) IC 840 51200000 622000 1932-BBGA, FCBGA

Quantity 385 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package1932-FBGA, FC (45x45)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1932-BBGA, FCBGANumber of I/O840Voltage820 mV - 880 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs234720Number of Logic Elements/Cells622000
Number of GatesN/AECCN3A001A2CHTS Code8542.39.0001
QualificationN/ATotal RAM Bits51200000

Overview of 5SGXEA7N3F45C2L – Stratix® V GX FPGA (622,000 logic elements, ~51.2 Mbits RAM, 840 I/Os, 1932-BBGA)

The 5SGXEA7N3F45C2L is a Stratix V GX field programmable gate array (FPGA) IC providing high logic density, substantial on-chip memory, and a large I/O count in a 1932-ball FCBGA package. It is a commercial-grade device intended for designs that require extensive programmable logic, embedded RAM, and a high pin-count I/O interface.

This device operates from a core supply range of 0.820 V to 0.880 V and is specified for commercial temperature operation from 0 °C to 85 °C, making it suitable for performance-focused electronics and complex system integration where RoHS compliance is required.

Key Features

  • High Logic Density  622,000 logic elements provide significant combinational and sequential resources for large-scale, logic-intensive designs.
  • Embedded Memory  Approximately 51.2 Mbits of on-chip RAM to support large buffers, FIFOs, and memory-mapped logic functions without external memory for many use cases.
  • Extensive I/O  840 I/O pins enable high port counts and broad interface support for multi-channel systems and dense board-level routing.
  • Power and Voltage  Core voltage supply range of 0.820 V to 0.880 V to match platform power-rail requirements and enable predictable core power planning.
  • Package and Mounting  1932-ball BGA (FCBGA) supplier package (1932-FBGA, FC 45×45) and surface-mount mounting type for high pin-count, board-level integration.
  • Commercial Temperature Grade  Rated for 0 °C to 85 °C operation for standard commercial environments.
  • RoHS Compliant  Materials and manufacturing processes meet RoHS requirements for lead-free assembly and regulatory compliance.

Typical Applications

  • High-density digital processing  Implement complex FPGA-based datapaths, accelerators, and large-state machines using the device’s abundant logic and memory resources.
  • Multi-channel I/O systems  Support boards and subsystems that require many parallel I/Os or numerous interface lanes, leveraging the 840 available I/O pins.
  • Network and communications equipment  Use the Stratix V GX family device for systems that consolidate logic, buffering, and protocol handling in a single FPGA.
  • Prototyping and OEM integration  Deploy as a central programmable device for prototype validation or production designs that benefit from high integration.

Unique Advantages

  • Substantial on-chip resources: 622,000 logic elements and ~51.2 Mbits of embedded RAM reduce dependence on external logic and memory components.
  • High I/O capacity: 840 I/Os simplify connectivity across dense board-level designs and support multiple parallel interfaces without external multiplexing.
  • High pin-count package: The 1932-ball FCBGA package allows maximum signal routing and power distribution density for complex systems.
  • Commercial temperature and RoHS compliance: Specified for 0 °C to 85 °C operation with RoHS status confirmed for regulatory compatibility.
  • Predictable core power planning: A defined core voltage window of 0.820 V–0.880 V helps with power supply design and thermal budgeting.

Why Choose 5SGXEA7N3F45C2L?

This Stratix V GX FPGA balances very high logic capacity, large embedded memory, and a high I/O count in a single commercial-grade FCBGA package. It is well suited to engineers and system designers who need a programmable device capable of consolidating logic, memory buffers, and extensive I/O on-board while maintaining predictable power and thermal parameters.

Choose this part for projects that require scalability in programmable resources, high pin density, and compliance with RoHS and commercial temperature requirements. Its combination of resources and package makes it a practical option for complex digital systems and board-level integration where on-chip capacity and high I/O are priorities.

Request a quote or submit an inquiry to receive pricing and availability information for the 5SGXEA7N3F45C2L Stratix V GX FPGA.

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