5SGXEA7N3F40I3

The 5SGXEA7N3F40I3 is an Intel Stratix® V GX field-programmable gate array (FPGA) supplied in a 1517-BBGA FCBGA package. It provides high-density programmable logic and on-chip memory with a large I/O count, targeted at industrial-grade applications requiring substantial logic capacity and extensive external interfacing.

Key Features

• Core Logic  622,000 logic elements for implementing complex digital systems and large-scale custom logic designs.
• Embedded Memory  Approximately 51.2 Mbits of on-chip RAM to support buffering, lookup tables, and local data storage.
• I/O Capacity  600 I/Os to accommodate broad peripheral connectivity and high pin-count interfaces.
• Package and Mounting  1517-BBGA (1517-FBGA, 40×40) FCBGA package with surface-mount mounting type for high-density board designs.
• Power Supply  Core voltage supply range of 820 mV to 880 mV to match targeted power-rail designs.
• Industrial Temperature Grade  Rated for operation from −40 °C to 100 °C, suitable for deployments that require extended temperature range.
• Regulatory Status  RoHS compliant.

Typical Applications

• High-performance signal processing  Implement large-scale DSP pipelines, filtering, and real-time data manipulation using the device’s high logic density and embedded RAM.
• Network and communications  Support for designs that need extensive I/O and high-density logic for packet processing, switching, and protocol offload.
• Industrial control and automation  Use in control systems and programmable logic controllers where industrial temperature operation and robust I/O counts are required.
• Compute acceleration and prototyping  Accelerate custom algorithms or prototype system-on-chip functions leveraging the large logic fabric and memory resources.

Unique Advantages

• Large programmable fabric: 622,000 logic elements enable integration of complex functions on a single device, reducing the need for multiple ICs.
• Significant on-chip memory: Approximately 51.2 Mbits of embedded RAM provides local storage for buffering and algorithm state, lowering external memory dependence.
• High I/O density: 600 I/Os simplify board-level design for applications requiring many interfaces or parallel connections.
• Industrial-grade temperature range: −40 °C to 100 °C operation supports deployment in harsher environments without specification compromise.
• Compact, high-density package: 1517-BBGA FCBGA package balances pin count and board-area efficiency for dense system designs.
• RoHS compliant: Meets common environmental compliance requirements for modern electronics manufacturing.

Why Choose 5SGXEA7N3F40I3?

The 5SGXEA7N3F40I3 delivers a combination of large logic capacity, substantial embedded memory, and broad I/O availability in an industrial-grade Stratix V GX FPGA package. It is well suited for engineers and system designers who need to consolidate complex digital functions onto a single programmable device while maintaining operation across an extended temperature range.

Choosing this FPGA supports scalable designs that demand both compute density and versatile interfacing, with the benefits of a well-established FPGA family and defined electrical characteristics for system-level power and thermal planning.

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