5SGXEA9K3H40C2NCV

IC FPGA 696 I/O 1517HBGA
Part Description

Stratix® V GX Field Programmable Gate Array (FPGA) IC 696 53248000 840000 1517-BBGA, FCBGA

Quantity 1,247 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package1517-HBGA (45x45)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1517-BBGA, FCBGANumber of I/O696Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level4 (72 Hours)Number of LABs/CLBs317000Number of Logic Elements/Cells840000
Number of GatesN/AECCNOBSOLETEHTS CodeN/A
QualificationN/ATotal RAM Bits53248000

Overview of 5SGXEA9K3H40C2NCV – Stratix® V GX FPGA, 840,000 logic elements, 696 I/Os

The 5SGXEA9K3H40C2NCV is a Stratix® V GX Field Programmable Gate Array (FPGA) IC from Intel, supplied in a 1517-BBGA FCBGA package. It delivers large on-chip logic capacity, abundant I/O, and substantial embedded RAM for designs that require dense programmable logic and significant memory resources within a commercial temperature range.

Targeted at applications that need high logic density and flexible I/O integration, this device provides a combination of 840,000 logic elements, approximately 53 Mbits of embedded memory, and up to 696 dedicated I/O pins while operating within a core voltage range of 870 mV to 930 mV.

Key Features

  • Core Logic  840,000 logic elements and 317,000 logic array blocks (LABs) provide large, programmable logic capacity for complex designs.
  • Embedded Memory  Approximately 53 Mbits of on-chip RAM to support large buffering, state storage, and memory-intensive logic functions.
  • Rich I/O  Up to 696 I/O pins to accommodate wide bus interfaces, parallel peripherals, and extensive external connectivity requirements.
  • Power and Voltage  Core supply range from 870 mV to 930 mV to match platform power-rail requirements precisely.
  • Package and Mounting  1517-BBGA (FCBGA) package, supplier device package 1517-HBGA (45×45), suited for surface-mount PCB assembly.
  • Temperature Grade  Commercial operating temperature range of 0 °C to 85 °C for standard commercial deployments.
  • Environmental Compliance  RoHS compliant.

Typical Applications

  • High-density digital processing  Implement large-scale custom logic functions and parallel processing pipelines using 840,000 logic elements and abundant on-chip RAM.
  • I/O-intensive systems  Support wide external interfaces and multi-channel I/O designs leveraging up to 696 I/O pins.
  • Embedded commercial products  Deploy in commercial-temperature embedded systems that require substantial programmable logic and memory resources.

Unique Advantages

  • Dense logic capacity: 840,000 logic elements enable consolidation of complex functions into a single device, reducing board-level component count.
  • Significant on-chip memory: Approximately 53 Mbits of embedded RAM supports large buffers, tables, and state machines without external memory.
  • Extensive I/O resources: 696 I/Os allow wide parallel interfaces and flexible connectivity options for diverse peripheral requirements.
  • Compact BGA package: 1517-BBGA (45×45 HBGA supplier package) offers a high-density footprint suitable for space-constrained PCBs.
  • Commercial temperature suitability: Rated for 0 °C to 85 °C operation for mainstream commercial applications.
  • Regulatory compliance: RoHS compliant for environmental and assembly requirements.

Why Choose 5SGXEA9K3H40C2NCV?

The 5SGXEA9K3H40C2NCV is positioned for designs that demand substantial programmable logic, abundant embedded memory, and wide I/O capability in a single commercial-grade Stratix V GX FPGA. Its combination of 840,000 logic elements, approximately 53 Mbits of on-chip RAM, and 696 I/Os makes it suitable for consolidating complex digital functions while minimizing external components.

As part of the Stratix V family from Intel, this device is supported by comprehensive device documentation and specifications, making it a practical choice for engineering teams focused on high-density, memory-rich programmable designs within commercial temperature limits.

Request a quote or submit an inquiry to check availability and pricing for the 5SGXEA9K3H40C2NCV. Our team can provide lead-time and ordering information to support your design schedule.

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