5SGXEA9K3H40C4G

The 5SGXEA9K3H40C4G is a Stratix® V GX family field programmable gate array (FPGA) intended for commercial-temperature applications. It delivers very large logic capacity and on-chip memory in a high-pin-count, surface-mount FCBGA package for dense board-level integration.

Key hardware attributes include approximately 840,000 logic elements, roughly 53.25 Mbits of embedded RAM, and 696 user I/Os, making this device suitable for complex digital designs that require extensive logic, memory and connectivity while operating from a low-voltage core supply.

Key Features

• Core Capacity Approximately 840,000 logic elements to implement large-scale programmable logic designs.
• Embedded Memory Approximately 53.25 Mbits of on-chip RAM for buffering, state storage and local data processing.
• I/O and Packaging 696 user I/O pins in a 1517-HBGA (45×45) / 1517-BBGA FCBGA surface-mount package for high-density interconnect and board integration.
• Power Core voltage supply range of 820 mV to 880 mV for the device core domain.
• Temperature & Grade Commercial grade operation specified from 0°C to 85°C.
• Standards & Compliance RoHS compliant.

Typical Applications

• High-density digital logic systems Implement large programmable logic networks and complex state machines using the device's extensive logic element count and embedded RAM.
• High-pin-count interface platforms Support multi-channel I/O and dense peripheral connectivity with 696 user I/Os for device-to-board and board-to-board interfacing.
• Compact board-level designs Use the 1517 FCBGA surface-mount package to achieve high integration density in space-constrained commercial electronics.
• Commercial embedded products Designed for systems and products that operate within the commercial temperature range (0°C to 85°C) and require significant on-chip resources.

Unique Advantages

• High logic and memory density: Approximately 840,000 logic elements combined with ~53.25 Mbits of embedded RAM supports large designs without extensive external memory.
• Extensive I/O count: 696 I/Os enable rich peripheral connectivity and flexible interfacing options for complex systems.
• Compact FCBGA packaging: 1517-HBGA (45×45) package provides a high-density footprint for modern PCB layouts and surface-mount assembly.
• Low-voltage core operation: Core supply range of 0.82 V to 0.88 V aligns with modern FPGA power domains and system power management strategies.
• Commercial temperature support: Rated for 0°C to 85°C operation, suitable for a wide range of commercial electronic products.
• RoHS compliant: Meets common environmental and manufacturing requirements for commercial electronics.

Why Choose 5SGXEA9K3H40C4G?

The 5SGXEA9K3H40C4G combines very large logic capacity, substantial embedded memory, and a high I/O count in a compact FCBGA package, making it a strong fit for commercial designs that require scalable programmable logic and on-chip resources. Its low-voltage core operation and commercial temperature rating make it appropriate for integration into a wide range of commercial embedded systems.

For design teams and procurement focused on high-density FPGA implementations, this Stratix V GX device delivers the core building blocks—logic, RAM and I/O—needed to consolidate functions on a single device while supporting standard manufacturing and environmental compliance expectations.

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