5SGXEA9K3H40C3N

The 5SGXEA9K3H40C3N is a Stratix V GX family FPGA from Intel, delivering a high-density programmable logic fabric and on-chip memory for advanced digital designs. It is offered in a commercial grade and packaged in a high-density 1517-BBGA (FCBGA) footprint.

Designed for applications that require large logic capacity, extensive I/O, and low-voltage core operation, this device combines 840,000 logic elements and approximately 53.25 Mbits of embedded memory to support complex signal processing, protocol bridging, and compute-acceleration tasks.

Key Features

• Core and Logic Capacity 840,000 logic elements (cells) provide extensive programmable logic resources for complex designs.
• Embedded Memory Approximately 53.25 Mbits of on-chip RAM for buffering, FIFOs, and local data storage.
• I/O and Connectivity 696 user I/O pins enable high-density external interfacing and broad connectivity options.
• Power and Voltage Core supply specified between 820 mV and 880 mV for the device core power domain.
• Package and Mounting 1517-BBGA (FCBGA) package; supplier device package listed as 1517-HBGA (45×45); surface-mount device suitable for high-density board layouts.
• Temperature and Grade Commercial grade with an operating temperature range of 0°C to 85°C.
• Compliance RoHS compliant.
• Series Transceiver Options (series-level datasheet) The Stratix V family documentation lists GX transceiver speed grades up to 14.1 Gbps and commercial speed-grade options for GX devices.

Typical Applications

• High-density data processing — Large logic element count and substantial embedded RAM enable complex signal processing and algorithm acceleration within a single device.
• High-pin-count I/O systems — 696 I/Os support dense external interfacing for multi-channel data acquisition, protocol bridging, or aggregator functions.
• Prototyping and platform development — The combination of logic capacity and on-chip memory makes this device suitable for system prototyping and development of FPGA-based platforms.

Unique Advantages

• Highly integrated logic and memory: 840,000 logic elements paired with approximately 53.25 Mbits of embedded RAM reduce the need for external memory in many designs.
• Extensive I/O capability: 696 I/O pins accommodate complex board-level connectivity and multi-interface systems.
• Compact, high-density package: 1517-BBGA/1517-HBGA (45×45) packages enable high-pin-count designs in a compact footprint.
• Low-voltage core operation: Core supply range of 820–880 mV supports modern low-voltage power architectures.
• Commercial operating range: Rated for 0°C to 85°C to match commercial-environment system requirements.
• RoHS compliance: Conforms to RoHS requirements for environmentally conscious designs.

Why Choose 5SGXEA9K3H40C3N?

The 5SGXEA9K3H40C3N places a high-capacity Stratix V GX FPGA into a compact, surface-mount BBGA package, delivering the logic density and embedded memory required for demanding digital designs. Its large I/O count and series-level transceiver options documented in the Stratix V datasheet make it a practical choice for designs that need significant on-chip resources and high pin counts.

This device suits engineering teams building complex prototypes, compute-acceleration modules, or multi-interface controllers who require a commercially rated FPGA with substantial logic and memory integration. The combination of density, packaging, and vendor-backed documentation supports scalable designs and long-term development cycles.

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