5SGXEA9K3H40I3L

The 5SGXEA9K3H40I3L is a Stratix V GX FPGA from Intel, delivering high-density programmable logic with a large on-chip memory footprint and extensive I/O capability. It targets designs that require significant logic resources, substantial embedded RAM, and industrial-grade operating range.

This device combines 840,000 logic elements, approximately 53.2 Mbits of embedded memory, and up to 696 I/O pins in a 1517-BBGA (FCBGA) package, making it suitable for complex programmable systems deployed in industrial environments.

Key Features

• Core Logic Capacity  840,000 logic elements for high-density programmable logic implementations.
• Embedded Memory  Approximately 53.2 Mbits of on-chip RAM to support large buffers, FIFOs, and data-intensive designs.
• I/O Density  Up to 696 I/O pins to support wide parallel interfaces and complex board-level connectivity.
• Power and Voltage  Core supply operating range of 820 mV to 880 mV to match system power-rail designs.
• Package and Mounting  1517-BBGA FCBGA package (supplier package listed as 1517-HBGA, 45×45) with surface-mount mounting.
• Industrial Temperature  Rated for industrial operation from –40 °C to 100 °C for deployment in robust environments.
• Regulatory Compliance  RoHS compliant for environmental and manufacturing requirements.

Typical Applications

• High-density digital processing  Architectures that require large quantities of logic elements and on-chip RAM for data-paths, packet processing, or algorithm acceleration.
• I/O-intensive systems  Designs needing extensive parallel interfaces or multiple peripheral connections, leveraging the device’s 696 I/Os.
• Industrial control and automation  Control systems and instrumentation that benefit from the device’s industrial temperature rating and surface-mount FCBGA packaging.
• Custom hardware accelerators  FPGA-based accelerators that use the available logic capacity and embedded memory to offload computationally intensive tasks.

Unique Advantages

• High logic integration: 840,000 logic elements reduce the need for multiple devices in complex designs.
• Substantial on-chip memory: Approximately 53.2 Mbits of embedded RAM supports large data buffering and state storage on-chip.
• Extensive I/O provisioning: 696 I/O pins enable broad connectivity without external multiplexing or expanders.
• Industrial-grade operation: –40 °C to 100 °C rating supports deployment in temperature-challenging environments.
• Compact FCBGA footprint: 1517-BBGA (1517-HBGA supplier package, 45×45) balances density and board-level integration for surface-mount assembly.
• Low-voltage core operation: Core supply range of 820 mV–880 mV for power-rail compatibility in modern systems.

Why Choose 5SGXEA9K3H40I3L?

The 5SGXEA9K3H40I3L positions itself as a high-capacity Stratix V GX FPGA option for developers building complex, I/O-rich, and memory-intensive programmable systems. Its combination of 840,000 logic elements, substantial embedded RAM, and nearly 700 I/Os enables consolidation of functions onto a single device, reducing board-level complexity.

Offered by Intel and specified for industrial temperatures, this device is appropriate for customers seeking a scalable FPGA platform with clear electrical parameters (including an 820 mV–880 mV core supply range) and RoHS compliance for production deployment.

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