5SGXEA9K3H40I4G

The 5SGXEA9K3H40I4G is a Stratix V GX FPGA from Intel, offered in an industrial temperature grade. This high-density FPGA provides 840,000 logic elements and approximately 53.25 Mbits of embedded on-chip memory, supporting complex, high-capacity designs that require large logic and memory resources.

Designed for surface-mount deployment in a 1517-BBGA / FCBGA package (supplier package: 1517-HBGA (45x45)), the device delivers extensive I/O connectivity with 696 I/O pins and operates from a core supply range of 820 mV to 880 mV. The Stratix V family datasheet describes GX-class transceiver speed-grade options available within the series.

Key Features

• Core Logic 840,000 logic elements for dense logic integration and complex programmable logic implementations.
• Embedded Memory Approximately 53.25 Mbits of on-chip RAM to support large buffering, state machines, and data-processing functions.
• I/O Capacity 696 I/O pins to accommodate high-pin-count interfaces and multi-channel system designs.
• Power Core voltage supply range of 820 mV to 880 mV for defined power-domain design and supply planning.
• Package & Mounting Surface-mount 1517-BBGA, FCBGA package (supplier package: 1517-HBGA (45x45)) for compact, high-density board integration.
• Temperature & Grade Industrial grade operation with an operating temperature range of −40°C to 100°C.
• Regulatory RoHS compliant.
• Stratix V GX Family Characteristics Device belongs to the Stratix V GX family; the family documentation notes GX transceiver speed-grade options within the series.

Typical Applications

• High-density programmable logic Designs that require large logic capacity and significant embedded memory can leverage the device's 840,000 logic elements and ~53.25 Mbits of RAM.
• High-pin-count systems Systems needing extensive external connectivity benefit from the device's 696 I/O pins.
• Industrial deployments Applications requiring industrial temperature operation can use this FPGA across −40°C to 100°C environments.

Unique Advantages

• High logic capacity: 840,000 logic elements enable consolidation of complex functions into a single device, reducing board-level component count.
• Substantial on-chip memory: Approximately 53.25 Mbits of embedded RAM supports large buffers and stateful processing without external memory.
• Extensive I/O: 696 I/Os provide flexibility for multi-channel interfaces, high-speed signaling, and broad peripheral integration.
• Industrial temperature rating: Rated for −40°C to 100°C operation to meet demanding thermal environments.
• Compact, high-density package: 1517-BBGA / FCBGA (supplier: 1517-HBGA (45x45)) enables high-pin-count routing in a compact footprint.
• Standards-conscious supply: RoHS compliance supports environmentally conscious designs and regulatory requirements.

Why Choose 5SGXEA9K3H40I4G?

The 5SGXEA9K3H40I4G positions itself where high integration and industrial robustness are required. With 840,000 logic elements, substantial embedded memory, and nearly 700 I/Os in a compact FCBGA package, it suits designs that must consolidate logic, memory, and I/O while meeting industrial thermal requirements.

Backed by Intel's Stratix V family documentation and design resources, this device is appropriate for engineering teams targeting scalable, high-density FPGA implementations that prioritize integration and board-level consolidation.

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