5SGXEA9N1F45C2L

The 5SGXEA9N1F45C2L is a Stratix® V GX FPGA IC from Intel, delivered in a 1932-ball FCBGA package for surface-mount assembly. This commercial-grade device provides very high logic density and large on-chip memory, with an I/O-rich device footprint for complex, programmable system designs.

Key on-device specifications include 840,000 logic elements, approximately 53.25 Mbits of embedded memory, and 840 I/O pins. The device is specified for a core voltage supply between 820 mV and 880 mV and rated for operation from 0 °C to 85 °C.

Key Features

• Core Density — 840,000 logic elements for implementing large-scale programmable logic and complex architectures.
• Logic Array Blocks — 317,000 logic array blocks (reported count) to support modular logic partitioning and resource allocation.
• Embedded Memory — Approximately 53.25 Mbits of on-chip RAM for buffering, FIFOs, and local storage without external memory.
• I/O Capacity — 840 I/O pins to support wide parallel interfaces, multi-channel connectivity, and extensive external peripheral integration.
• Power and Core Supply — Core voltage specified from 820 mV to 880 mV to match targeted power-domain designs and regulator selection.
• Package and Mounting — 1932-BBGA (FCBGA) package; supplier device package listed as 1932-FBGA, FC (45×45) for surface-mount PCB assembly.
• Commercial Temperature Grade — Rated for operation from 0 °C to 85 °C, suitable for commercial and controlled-environment applications.
• Compliance — RoHS compliant, meeting common environmental directive requirements for lead-free assembly.

Unique Advantages

• High logic capacity: 840,000 logic elements enable dense integration of complex algorithms and multiple hardware engines on a single device.
• Significant on-chip memory: Approximately 53.25 Mbits of embedded RAM reduces dependence on external memory and simplifies board-level memory architectures.
• Extensive I/O support: 840 I/O pins provide flexibility for wide buses, multiple interfaces, and high channel counts without external expanders.
• Compact, production-ready package: 1932-ball FCBGA surface-mount package supports high-density PCB layouts while offering predictable assembly characteristics.
• Commercial-grade operating range: Specified 0 °C to 85 °C operation to match commercial product deployments and controlled environments.
• RoHS compliant: Facilitates lead-free manufacturability and adherence to environmental regulations.

Why Choose 5SGXEA9N1F45C2L?

The 5SGXEA9N1F45C2L positions itself as a high-density Stratix V GX FPGA option for designers who need substantial on-chip logic and memory combined with a large I/O complement. Its specification set—840,000 logic elements, roughly 53.25 Mbits of embedded RAM, and 840 I/Os—supports integrating multiple subsystems and buffering-heavy designs within a single device footprint.

Delivered in a 1932-BBGA (FCBGA) package and rated for commercial temperature operation, the device offers a balance of integration and manufacturability for complex programmable systems where board space and system integration matter. RoHS compliance and the documented supply and temperature ranges make it suitable for commercial production environments that require verifiable device parameters.

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