5SGXEA9N1F45C2LN

The 5SGXEA9N1F45C2LN is a Stratix® V GX Field Programmable Gate Array (FPGA) in a 1932‑ball BGA package intended for commercial temperature applications. The device provides very high logic density and extensive on‑chip RAM and I/O resources for complex, programmable digital designs.

With 840,000 logic elements, approximately 53.25 Mbits of embedded memory and 840 user I/O pins, this FPGA targets designs that require large-scale programmable logic, ample embedded memory, and dense I/O integration while operating within a commercial temperature range.

Key Features

• Core Logic  840,000 logic elements (cells) to implement large, parallelizable digital designs and complex state machines.
• Embedded Memory  Approximately 53.25 Mbits of on‑chip RAM available for buffering, FIFOs, and memory‑intensive functions.
• I/O Capacity  840 user I/O pins to support high‑pin‑count interfaces, dense board routing, and multi‑channel connectivity.
• Power Supply  Core supply range specified at 820 mV to 880 mV to align with system power‑rail planning and decoupling requirements.
• Package & Mounting  1932‑BBGA (FCBGA) supplier package (1932‑FBGA, FC 45×45) in a surface‑mount form factor for compact, high‑density PCB layouts.
• Temperature & Grade  Commercial grade with an operating temperature range of 0 °C to 85 °C, specified for standard commercial environments.
• Compliance  RoHS compliant, supporting environmental and regulatory sourcing requirements.

Typical Applications

• High‑performance digital signal processing  Use the device’s 840,000 logic elements and large embedded RAM to implement wide parallel datapaths and multi‑channel DSP algorithms.
• Networking and packet processing  Large logic capacity and 840 I/O pins enable implementation of custom packet engines, switching logic, and high‑density interface aggregation.
• Compute acceleration and prototyping  High logic density and significant on‑chip memory make the device suitable for hardware acceleration and system prototyping where programmable hardware resources are required.

Unique Advantages

• High logic density: 840,000 logic elements let you consolidate complex functions into a single device, reducing multi‑device BOM and board complexity.
• Substantial embedded memory: Approximately 53.25 Mbits of RAM supports large buffers, FIFOs, and memory‑centric functions without external memory for many use cases.
• Extensive I/O availability: 840 I/O pins provide flexibility for interfacing to multiple peripherals, buses, and high‑channel counts on a single FPGA.
• Compact, high‑density package: The 1932‑BBGA FCBGA package enables dense PCB integration while keeping the device footprint manageable for complex boards.
• Commercial temperature suitability: Rated for 0 °C to 85 °C operation, aligning with a wide range of standard commercial electronics deployments.
• RoHS compliant: Meets environmental sourcing expectations for many global supply chains.

Why Choose 5SGXEA9N1F45C2LN?

The 5SGXEA9N1F45C2LN combines very high logic capacity, significant embedded RAM and a large I/O count in a single commercial‑grade Stratix V GX FPGA package. It is well suited to designers who need to implement complex, memory‑intensive and I/O‑rich programmable logic on a compact board footprint while maintaining compliance with RoHS requirements.

This device is positioned for engineering teams developing high‑density FPGA designs that require a balance of logic resources, on‑chip memory and pin‑out flexibility, backed by Stratix V family documentation and support materials.

Request a quote or submit an inquiry to check availability, pricing, and lead time for the 5SGXEA9N1F45C2LN. Our team can provide a formal quote and assist with sourcing for your project.