5SGXEA9N1F45I2G

IC FPGA 840 I/O 1932FBGA
Part Description

Stratix® V GX Field Programmable Gate Array (FPGA) IC 840 53248000 840000 1932-BBGA, FCBGA

Quantity 326 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Device Package1932-FBGA, FC (45x45)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1932-BBGA, FCBGANumber of I/O840Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs317000Number of Logic Elements/Cells840000
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits53248000

Overview of 5SGXEA9N1F45I2G – Stratix® V GX Field Programmable Gate Array (840k logic elements, 840 I/Os)

The 5SGXEA9N1F45I2G is a Stratix V GX Field Programmable Gate Array (FPGA) from Intel, offered in an industrial temperature grade. It provides a high-density programmable fabric designed for applications that require substantial logic capacity, abundant embedded memory, and a large number of I/O connections.

With 840,000 logic elements, approximately 53.25 Mbits of embedded RAM, and up to 840 user I/Os in a 1932-BBGA FCBGA package, this device targets systems that need integrated digital processing, extensive on-chip memory, and high I/O density while operating across an industrial temperature range.

Key Features

  • Core Logic 840,000 logic elements for implementing large-scale programmable logic and custom digital functions.
  • Embedded Memory Approximately 53.25 Mbits of on-chip RAM to support large buffering, lookup tables, and state storage without external memory.
  • I/O Density Up to 840 user I/Os to consolidate multiple interfaces and board-level connectivity.
  • Transceiver Options (Series-Level) Stratix V GX series documentation lists transceiver speed-grade options (series examples include channel rates up to 14.1 Gbps), enabling high-speed serial connectivity where applicable.
  • Power and Core Supply Core supply range specified at 870 mV to 930 mV to support the device’s internal power domain requirements.
  • Package & Mounting 1932-BBGA (FCBGA) supplier device package, 45×45 mm, with surface-mount construction for dense PCB integration.
  • Temperature & Grade Industrial grade operation from −40 °C to 100 °C for deployment in temperature-sensitive environments.
  • Environmental Compliance RoHS compliant.

Typical Applications

  • High-density signal processing — Use the 840,000 logic elements and large embedded RAM to implement complex DSP pipelines, custom accelerators, and parallel processing engines.
  • Networking and telecommunications — Leverage the high I/O count and Stratix V GX transceiver speed-grade options for packet processing, switch fabric, and high-speed link interfacing.
  • Compute acceleration and data plane offload — Implement hardware accelerators and protocol engines that benefit from abundant programmable logic and on-chip memory.
  • Industrial control and instrumentation — Industrial temperature rating and robust packaging support deployment in factory automation and instrumentation systems.

Unique Advantages

  • High integration of logic and memory: 840,000 logic elements combined with ~53.25 Mbits of embedded RAM enables large designs without immediate reliance on external memory.
  • Extensive I/O consolidation: Up to 840 I/Os allow multiple interfaces and parallel signals to be routed directly to the FPGA, simplifying board-level design.
  • Industrial temperature capability: Rated from −40 °C to 100 °C to meet demanding thermal environments.
  • Compact, high-density package: 1932-BBGA (FCBGA, 45×45) supports high pin-count layouts in a surface-mount form factor.
  • Documented series capabilities: Stratix V GX family documentation includes transceiver speed-grade options and detailed electrical characteristics for system-level design planning.
  • RoHS compliant: Meets common environmental directives for lead-free assembly.

Why Choose 5SGXEA9N1F45I2G?

The 5SGXEA9N1F45I2G positions itself for designs that require a high degree of on-chip logic, significant embedded memory, and large I/O capacity within an industrial temperature envelope. Its Stratix V GX designation and supporting documentation provide designers with a clear specification set for high-density programmable implementations.

This device is suited for engineers and system designers building complex, I/O-heavy, and memory-intensive FPGA solutions who need a documented Intel Stratix V family device with defined core supply and industrial operating range.

Request a quote or submit an inquiry for pricing and availability to begin specifying 5SGXEA9N1F45I2G in your design.

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