5SGXEA9N2F45C2G

The 5SGXEA9N2F45C2G is a Stratix® V GX Field Programmable Gate Array (FPGA) IC offered in a 1932-BBGA (FCBGA) package. It provides a high logic density device option within the Stratix V family for commercial-grade designs.

With 840,000 logic elements, approximately 53.25 Mbits of embedded memory, and 840 I/O pins, this device targets applications that require large on-chip logic and memory resources combined with a high I/O count. The device is specified for surface-mount assembly and commercial temperature operation.

Key Features

• Core / Logic Density  840,000 logic elements (cells) to implement large combinational and sequential designs.
• Embedded Memory  Approximately 53.25 Mbits of on-chip RAM (53,248,000 bits) for large buffering and on-chip storage.
• I/O Capacity  840 user I/O pins to support wide parallel interfaces and large system-level connectivity.
• Power  Core supply voltage specified from 870 mV to 930 mV, enabling defined power-rail design for the FPGA core.
• Package & Mounting  1932-BBGA, FCBGA package (supplier package: 1932-FBGA, FC 45×45) in a surface-mount form factor suitable for high-density PCB layouts.
• Temperature & Grade  Commercial grade device rated for operation from 0 °C to 85 °C.
• Environmental Compliance  RoHS compliant.

Typical Applications

• High-density signal processing  Implement large DSP pipelines and complex logic that benefit from 840,000 logic elements and substantial on-chip RAM.
• Network and communications infrastructure  Use the high I/O count and on-chip memory for packet processing, switching, and aggregation functions in commercial network equipment.
• Compute acceleration and offload  Deploy as a programmable accelerator where large logic capacity and memory are needed to implement custom compute kernels and buffering.
• Prototyping and systems integration  Support board-level prototypes and system integration tasks that require a high-pin-count, high-density FPGA in a surface-mount FCBGA package.

Unique Advantages

• High logic capacity: 840,000 logic elements provide the headroom to implement large, complex designs without external glue logic.
• Significant on-chip memory: Approximately 53.25 Mbits of embedded RAM reduces reliance on external memory for many buffering and storage needs.
• Extensive I/O connectivity: 840 I/O pins support broad interfacing options and high parallel bandwidth to external devices and subsystems.
• Defined core voltage range: 870 mV–930 mV supply specification aids predictable power-rail design for the FPGA core.
• Commercial temperature rating: Rated 0 °C to 85 °C for standard commercial deployments.
• RoHS compliant: Aligns with environmental and manufacturing requirements for lead-free assembly.

Why Choose 5SGXEA9N2F45C2G?

The 5SGXEA9N2F45C2G delivers a combination of high logic density, substantial embedded memory, and a large I/O count in a 1932-BBGA FCBGA package suitable for surface-mount assembly. As a Stratix V GX device, it is positioned for commercial designs that require significant on-chip resources and robust interfacing capabilities.

This device is appropriate for teams designing high-density signal processing, communications, and compute-acceleration solutions where the specified core voltage, package, and temperature range match system requirements. Its specifications make it a practical choice when substantial on-chip logic and memory are primary design drivers.

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