5SGXEA9N2F45C2LN

The 5SGXEA9N2F45C2LN is a Stratix V GX family FPGA delivering very high logic capacity, abundant embedded RAM, and a large I/O complement in a high-density FCBGA package. It is a commercial-grade device rated for 0 °C to 85 °C and is RoHS compliant.

With 840,000 logic elements, approximately 53.248 Mbits of on-chip RAM and 840 I/Os, this device is suited to designs that require dense programmable logic, substantial on-chip memory, and extensive external connectivity while operating from a 820 mV–880 mV core supply.

Key Features

• Logic Capacity — 840,000 logic elements to implement high-density digital designs and complex algorithms on a single device.
• Embedded Memory — Approximately 53.248 Mbits of total RAM bits for large on-chip buffers, FIFOs, and memory-intensive processing.
• I/O — 840 available I/O pins to support broad system interfacing and multiple parallel or serial connections.
• Power — Core voltage supply range of 820 mV to 880 mV to match system power-rail requirements.
• Package & Mounting — 1932-BBGA, FCBGA package (supplier package listed as 1932-FBGA, FC (45×45)) in a surface-mount form factor for high-pin-count integration.
• Temperature & Grade — Commercial grade device with an operating temperature range of 0 °C to 85 °C.
• Compliance — RoHS compliant for environmentally restricted applications.

Typical Applications

• High-density digital processing — Implement complex logic, signal processing, and control functions within a single FPGA thanks to large logic and memory resources.
• Memory-intensive algorithms — Use the substantial on-chip RAM for buffering, lookup tables, and embedded data storage without relying solely on external memory.
• High I/O system integration — Interface multiple peripherals, expansion buses, or parallel subsystems using the device’s 840 I/Os.
• Advanced prototyping and development — Validate and iterate complex system architectures that require significant programmable fabric and I/O capacity.

Unique Advantages

• High logic density: 840,000 logic elements enable consolidation of multi-chip designs into a single programmable device, reducing board-level complexity.
• Large embedded memory: Approximately 53.248 Mbits of on-chip RAM supports memory-hungry functions and reduces external memory bandwidth requirements.
• Extensive I/O count: 840 I/Os provide flexibility for broad system connectivity and parallel interfacing options.
• Compact, high-pin-count package: The 1932-BBGA FCBGA footprint enables high signal density while maintaining a surface-mount form factor.
• Commercial temperature rating: Rated 0 °C to 85 °C for standard commercial deployments.
• Regulatory readiness: RoHS compliance simplifies selection for designs requiring lead-free components.

Why Choose 5SGXEA9N2F45C2LN?

The 5SGXEA9N2F45C2LN positions itself as a high-capacity Stratix V GX FPGA option for designs that demand significant programmable logic, large on-chip RAM, and a wide I/O complement in a compact FCBGA package. Its commercial temperature range and RoHS compliance make it suitable for standard production environments where high integration density and embedded memory are priorities.

As part of the Stratix V family, this device is documented within the Stratix V device datasheet set, offering the specification-level information needed to evaluate thermal, electrical, and I/O requirements for complex system designs.

Request a quote or submit a sales inquiry today to check pricing and availability for the 5SGXEA9N2F45C2LN and to discuss how this Stratix V GX device can meet your high-density FPGA requirements.