5SGXEA9N2F45C3G

The 5SGXEA9N2F45C3G is a Stratix® V GX Field Programmable Gate Array (FPGA) in a 1932-BBGA FCBGA package, designed for high-density, programmable logic implementations. With 840,000 logic elements and approximately 53 Mbits of embedded memory, this commercial-grade device targets applications that require large fabric capacity, extensive I/O, and high integration in a surface-mount BGA form factor.

Key value comes from its combination of large logic and memory resources, high I/O count, and compact 1932-ball package (supplier package: 1932-FBGA, FC, 45×45), enabling dense system integration where board space and on-chip capacity matter.

Key Features

• Core capacity — 840,000 logic elements to implement complex custom logic, datapaths, and control functions within a single device.
• Embedded memory — Approximately 53 Mbits of on-chip RAM to support large buffers, FIFOs, and memory-intensive functions without external RAM.
• High I/O count — 840 user I/Os to interface with high-pin-count systems, multi-channel peripherals, and parallel interfaces.
• Package & mounting — 1932-BBGA (FCBGA) surface-mount package; supplier device package listed as 1932-FBGA, FC (45×45) for compact, high-density board designs.
• Power rails — Core voltage supply range of 820 mV to 880 mV, allowing designers to plan power delivery and decoupling to match device requirements.
• Commercial operating range — Rated for 0 °C to 85 °C operation and specified as commercial grade for temperature-critical design planning.
• Regulatory status — RoHS compliant, suitable for designs requiring lead-free component compliance.

Typical Applications

• High-density data processing — Large logic and embedded memory support complex data-paths, packet processing, and custom acceleration functions.
• Communications and networking — High I/O count and large fabric capacity enable multi-channel protocol implementation and aggregation functions.
• Video and signal processing — Substantial on-chip RAM and logic resources provide the capacity needed for buffering, filter pipelines, and real-time processing blocks.

Unique Advantages

• Substantial on-chip capacity: 840,000 logic elements combined with ~53 Mbits of RAM reduce dependence on external logic and memory, simplifying BOM and board routing.
• High connector density: 840 I/Os let you implement wide parallel interfaces and multiple peripheral channels without multiplexing compromises.
• Compact, manufacturable package: 1932-BBGA (45×45) surface-mount package offers a high pin-count solution in a compact footprint for space-constrained PCBs.
• Defined power envelope: Core supply range (820–880 mV) gives clear requirements for power-supply design and thermal budgeting.
• Commercial temperature rating: Specified 0 °C to 85 °C operation aligns with a wide range of commercial electronic products and development platforms.
• RoHS compliant: Meets lead-free requirements for modern manufacturing processes.

Why Choose 5SGXEA9N2F45C3G?

The 5SGXEA9N2F45C3G provides a high-density Stratix V GX FPGA solution when on-chip logic, memory, and I/O capacity are primary design drivers. Its combination of 840,000 logic elements, approximately 53 Mbits of embedded RAM, and 840 I/Os in a 1932-ball BGA package enables consolidation of complex system functions into a single programmable device, reducing board-level complexity.

This device is suited for design teams developing commercial temperature-range systems that require scalable programmable logic, significant local memory, and a high pin count in a manufacturable surface-mount package. Its clear electrical and thermal operating points support predictable integration into power and PCB designs.

Request a quote or submit a pricing inquiry to evaluate 5SGXEA9N2F45C3G for your next high-density FPGA design.