5SGXEA9N2F45C2NCV

The 5SGXEA9N2F45C2NCV is an Intel Stratix® V GX field-programmable gate array (FPGA) IC optimized for high-density, high-performance digital designs. It provides a large fabric of 840,000 logic elements and approximately 53.2 Mbits of embedded memory, enabling complex logic and large buffering on-chip.

Packaged in a 1932-ball FCBGA (supplier package: 1932-FBGA, FC, 45×45) and supplied as a commercial-grade device (0 °C to 85 °C), this surface-mount FPGA targets applications that require extensive I/O and on-chip resources while maintaining commercial temperature operation and RoHS compliance.

Key Features

• Logic Capacity  840,000 logic elements for implementing complex digital functions and large-scale programmable logic designs.
• Embedded Memory  Approximately 53.2 Mbits of on-chip RAM to support buffering, frame storage, and large data-path implementations.
• I/O Density  840 user I/O pins to support wide parallel interfaces, multiple buses, and high-pin-count system integrations.
• Power and Core Supply  Core supply voltage range of 0.870 V to 0.930 V to match target system power rails and enable defined core operation.
• Package & Mounting  1932-ball BGA (FCBGA) surface-mount package; supplier package listed as 1932-FBGA, FC (45×45) for high-density board integration.
• Operating Condition  Commercial temperature grade with an operating range of 0 °C to 85 °C, and RoHS-compliant construction.

Typical Applications

• High-density networking and switching  Large logic capacity and extensive I/O make the device suited for packet processing, interface bridging, and switching fabrics that require on-chip logic and memory.
• Data-path acceleration  Significant embedded RAM and logic resources support buffering, pipeline implementations, and custom dataflow accelerators.
• Signal processing and FPGA-based compute  High logic element count and abundant I/O enable implementation of DSP pipelines and custom algorithms that demand wide parallelism and local memory.

Unique Advantages

• High logic density: 840,000 logic elements let designers consolidate complex functions into a single FPGA, reducing system BOM and board count.
• Substantial on-chip memory: Approximately 53.2 Mbits of embedded RAM support large buffering, lookup tables, and data staging without external memory dependency.
• Extensive I/O availability: 840 I/Os enable broad external interfacing for parallel buses, multiple peripherals, and multi-lane connectivity.
• Commercial temperature operation: Rated 0 °C to 85 °C for standard commercial deployments and environments.
• RoHS-compliant and surface-mount package: 1932-ball FCBGA in a 45×45 supplier footprint supports high-density PCB layouts and environmental compliance.
• Defined core supply window: 0.870–0.930 V core voltage specification simplifies power-supply planning and thermal/power budgeting.

Why Choose 5SGXEA9N2F45C2NCV?

The 5SGXEA9N2F45C2NCV positions itself for designs that require substantial programmable logic, on-chip memory, and wide I/O capacity in a single commercial-grade FPGA package. Its combination of 840,000 logic elements, roughly 53.2 Mbits of embedded RAM, and 840 I/Os supports consolidation of complex systems, heavy data-path workloads, and dense interface requirements.

This device is well suited for engineering teams seeking a high-capacity Stratix V GX FPGA for demanding digital signal processing, networking, and compute-acceleration tasks while retaining clear electrical and packaging specifications for system integration and procurement.

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