5SGXEA9N2F45C3NCV

The 5SGXEA9N2F45C3NCV is a Stratix® V GX Field Programmable Gate Array (FPGA) IC designed for high-density programmable logic applications. This commercial-grade device integrates 840,000 logic elements and approximately 53.25 Mbits of embedded RAM, with 840 user I/Os in a 1932-ball BGA (FCBGA) package.

Key electrical parameters include a core supply range of 820 mV to 880 mV and an operating temperature range of 0°C to 85°C. The device is RoHS compliant and provided in a surface-mount package suitable for dense board-level integration.

Key Features

• Core Density  840,000 logic elements provide high programmable logic capacity for complex designs.
• Embedded Memory  Approximately 53.25 Mbits of on-chip RAM to support large buffering, data storage, and state-machine implementations.
• I/O  840 user I/O pins to support substantial external interfacing and high pin-count designs.
• Power  Core supply voltage specified from 820 mV to 880 mV, enabling designs that target the Stratix V GX core-voltage operating window.
• Package & Mounting  1932-BBGA (FCBGA) package; supplier device package listed as 1932-FBGA, FC (45×45). Surface-mount mounting type for standard PCB assembly.
• Grade & Temperature  Commercial grade with an operating temperature range of 0°C to 85°C.
• Compliance  RoHS compliant.
• Datasheet Coverage  The Stratix V device datasheet documents electrical and switching characteristics, including operating conditions, power consumption, I/O timing, and transceiver specifications for the Stratix V family.

Unique Advantages

• High logic capacity: 840,000 logic elements enable consolidation of complex functions and multi‑domain logic on a single device, reducing system-level component count.
• Substantial on-chip RAM: Approximately 53.25 Mbits of embedded memory supports large buffers, packet queues, and state storage without immediate need for external memory.
• Extensive I/O resources: 840 user I/Os facilitate dense connectivity to sensors, interfaces, and peripheral devices in high-channel-count applications.
• Compact BGA footprint: 1932-ball FCBGA packaging delivers high pin density in a surface-mount form factor for space-constrained PCBs.
• Commercial operating range: Rated for 0°C to 85°C, suitable for general-purpose and commercial electronic systems.
• Regulatory readiness: RoHS compliance simplifies environmental and manufacturing requirements for consumer and commercial products.

Why Choose 5SGXEA9N2F45C3NCV?

The 5SGXEA9N2F45C3NCV positions itself as a high-density Stratix V GX FPGA option for designs that require large logic capacity, substantial on-chip RAM, and a high number of I/Os in a compact BGA package. Its specified core voltage window (820–880 mV), commercial temperature rating (0°C–85°C), and RoHS compliance make it suitable for a wide range of commercial electronic applications where integration density and I/O bandwidth are priorities.

Designers can reference the Stratix V device datasheet for the family’s electrical and switching characteristics—covering operating conditions, power, I/O timing, and transceiver specifications—to support system-level planning and integration.

Request a quote or submit an inquiry for availability and pricing to begin evaluating the 5SGXEA9N2F45C3NCV for your next high-density FPGA design.