5SGXEA9N2F45I2LG

The 5SGXEA9N2F45I2LG is a Stratix® V GX Field Programmable Gate Array (FPGA) in an industrial temperature grade, designed for high-density programmable logic applications. It combines a large logic fabric with substantial on-chip memory and a high I/O count to support complex, I/O‑intensive designs.

Built for surface-mount deployment in a 1932-BBGA (FCBGA) package, this device provides a compact, high-pin-count option where robust operating range and scalability of programmable logic resources are required.

Key Features

• Core Logic 840,000 logic elements to implement large-scale digital designs and custom logic functions.
• Embedded Memory Approximately 53.25 Mbits of on-chip RAM to support buffering, look-up tables, and data-intensive processing close to the fabric.
• I/O Capacity 840 I/O to accommodate high fanout interfaces, parallel buses, and multi-channel connectivity.
• Power and Voltage Core supply voltage range of 820 mV to 880 mV for defined power-domain planning and supply sequencing.
• Package & Mounting 1932-BBGA, FCBGA (supplier package: 1932-FBGA, FC 45×45) in a surface-mount form factor for dense board-level integration.
• Temperature & Grade Industrial grade with an operating temperature range of −40 °C to 100 °C for deployment in demanding environments.
• Standards Compliance RoHS compliant to support regulatory and environmental requirements.

Typical Applications

• High-density signal processing — Leverage 840,000 logic elements and substantial embedded RAM for FPGA-based DSP pipelines and custom accelerators.
• Multi‑channel I/O hubs — Use 840 I/O to aggregate and route parallel interfaces, bridging multiple peripherals or sensor arrays.
• Industrial control and automation — Industrial temperature rating (−40 °C to 100 °C) and high I/O enable real-time control, motor drives, and factory instrumentation.
• Prototype and system integration — High logic density and on-chip memory make the device suitable for complex prototypes and consolidated system functions on a single FPGA.

Unique Advantages

• Large programmable fabric: 840,000 logic elements allow implementation of extensive custom logic without partitioning across multiple devices.
• On‑chip memory for latency‑sensitive tasks: Approximately 53.25 Mbits of embedded RAM reduces external memory dependence and improves data-path performance.
• High I/O count: 840 I/O simplifies board-level routing for multi-channel systems and dense connector interfaces.
• Industrial operating range: −40 °C to 100 °C supports deployments in temperature-challenging environments.
• Compact, high‑pin package: 1932-BBGA (45×45 mm footprint) delivers high pin density while maintaining a surface-mount profile for modern PCB assembly.
• RoHS compliant: Aligns with environmental and manufacturing process requirements.

Why Choose 5SGXEA9N2F45I2LG?

The 5SGXEA9N2F45I2LG positions itself as a high-density, industrial-grade Stratix V GX FPGA option for engineers who need substantial logic capacity, large embedded memory, and extensive I/O in a compact surface-mount package. Its defined core voltage range and operating temperature make it suitable for robust system designs that require long-term stability and deterministic on-chip resources.

This device is appropriate for development teams targeting consolidation of complex functions onto a single FPGA, reducing board-level complexity while retaining flexibility for future reconfiguration.

Request a quote or submit an inquiry to discuss pricing, lead time, and integration details for the 5SGXEA9N2F45I2LG. Our team can provide availability and ordering information to support your project schedule.