5SGXEA9N2F45I3L

The 5SGXEA9N2F45I3L is a Stratix V GX family Field Programmable Gate Array (FPGA) from Intel, delivered in a 1932‑ball FCBGA surface‑mount package. It provides a high level of programmable logic, on‑chip memory, and dense I/O for complex embedded and industrial designs.

With 840,000 logic elements, approximately 53 Mbits of embedded memory and 840 I/O pins, this device targets designs that require substantial logic capacity, significant on‑chip RAM, and large I/O counts within an industrial temperature range.

Key Features

• Core Logic  840,000 logic elements for integrating large-scale programmable logic into a single device.
• Embedded Memory  Approximately 53 Mbits of on‑chip RAM to support data buffering, state storage, and complex algorithms without immediate reliance on external memory.
• High‑Density I/O  Up to 840 I/O pins to accommodate multiple parallel interfaces and dense board-level connectivity.
• Package & Mounting  1932‑BBGA (FCBGA) supplier package (1932‑FBGA, FC 45×45), surface‑mount for compact board designs and high pin count routing.
• Power  Core voltage supply range of 820 mV to 880 mV for the device core power domain.
• Temperature & Grade  Industrial grade with an operating temperature range of −40 °C to 100 °C for deployment in temperature‑sensitive environments.
• Environmental Compliance  RoHS compliant to meet standard environmental and manufacturing requirements.

Typical Applications

• High‑density programmable systems  Designs that require extensive logic capacity—up to 840,000 logic elements—and substantial embedded RAM for complex signal processing or algorithm implementation.
• I/O‑intensive platforms  Systems needing a large number of external interfaces can leverage the device’s 840 I/O pins for parallel buses, multiport connectivity, and dense board integration.
• Industrial embedded equipment  Applications that benefit from the device’s industrial temperature range (−40 °C to 100 °C) and RoHS compliance for robust, regulatory‑aware deployments.
• Compact, surface‑mount designs  Boards requiring a high‑pin‑count FPGA in a space‑efficient 1932‑ball FCBGA package.

Unique Advantages

• High logic capacity: Integrate complex functions and large state machines within a single device using 840,000 logic elements, reducing external component count.
• Substantial on‑chip memory: Approximately 53 Mbits of embedded RAM helps minimize external memory dependency and speeds local data access.
• Dense I/O capability: 840 I/Os enable flexible interfacing options for multiport designs and high‑throughput data paths.
• Industrial temperature performance: Rated for −40 °C to 100 °C operation to meet demanding environmental requirements.
• Low‑voltage core operation: Core supply between 0.82 V and 0.88 V aligns with modern low‑voltage power architectures.
• Manufacturing and compliance ready: Surface‑mount 1932‑ball FCBGA package and RoHS compliance support standard SMT assembly and regulatory needs.

Why Choose 5SGXEA9N2F45I3L?

The 5SGXEA9N2F45I3L positions itself as a high‑capacity Stratix V GX FPGA suitable for designs that demand large programmable logic resources, significant on‑chip memory, and extensive I/O in an industrial temperature envelope. Its package and electrical characteristics make it a practical option for dense board layouts and power‑optimized systems.

As part of the Stratix V GX family from Intel, this device benefits from established device documentation and family support, offering a clear path for engineers building scalable, high‑performance FPGA‑based systems.

Request a quote or submit an inquiry today to check pricing and availability for the 5SGXEA9N2F45I3L and to discuss how it fits your next high‑density FPGA design.