5SGXEA9N2F45I3N

The 5SGXEA9N2F45I3N is a Stratix V GX field programmable gate array (FPGA) IC optimized for high-density, I/O‑rich designs. It combines a large logic capacity with substantial on‑chip RAM and extensive I/O to support complex digital processing and interface aggregation.

Built for industrial environments, this device provides a wide operating temperature range and a high-pin‑count FCBGA package. The Stratix V GX family specification includes multiple transceiver speed grades for designs that require high-speed serial connectivity.

Key Features

• Core logic — 840,000 logic elements to implement large-scale combinational and sequential logic functions.
• Embedded memory — approximately 53.248 Mbits of on‑chip RAM for buffering, FIFOs, and local data storage.
• I/O density — 840 I/O pins to support extensive peripheral and high‑pin‑count interface requirements.
• Transceiver options (family) — Stratix V GX devices include transceiver speed grades (family-level data shows GX channel options including 14.1 Gbps, 12.5 Gbps, and 8.5 Gbps) for high‑speed serial links.
• Power supply — core voltage supply range of 820 mV to 880 mV for the device core.
• Package and mounting — 1932‑BBGA FCBGA package (supplier device package: 1932‑FBGA, FC 45×45) with surface‑mount mounting type.
• Temperature and grade — industrial grade with an operating temperature range of −40 °C to 100 °C.
• Regulatory — RoHS compliant.

Typical Applications

• High-speed serial communications — Family-level transceiver speed grades (including up to 14.1 Gbps) combined with numerous I/Os make this device suitable for high-throughput link aggregation and protocol bridging.
• FPGA-based acceleration and signal processing — Large logic capacity and approximately 53.248 Mbits of embedded memory enable complex datapath logic, buffering, and on‑chip acceleration functions.
• Industrial control and instrumentation — Industrial temperature rating (−40 °C to 100 °C) and a rugged FCBGA package support deployment in factory automation and instrumentation systems.

Unique Advantages

• High logic capacity: 840,000 logic elements allow implementation of large, integrated designs without partitioning across multiple devices.
• Substantial on‑chip memory: Approximately 53.248 Mbits of RAM reduces external memory dependency for many buffering and local storage needs.
• Extensive I/O count: 840 I/Os provide flexibility for complex interface mixes and dense connector requirements.
• Industrial robustness: Rated for −40 °C to 100 °C operation to meet industrial deployment conditions.
• High‑pin‑count package: 1932‑BBGA FCBGA package supports high routing density and integration in compact board layouts.
• Standards‑friendly compliance: RoHS compliance supports use in regulated electronic assemblies.

Why Choose 5SGXEA9N2F45I3N?

The 5SGXEA9N2F45I3N positions itself as a high‑density Stratix V GX FPGA option for engineers who need extensive logic resources, significant embedded RAM, and a large I/O complement in an industrial‑rated package. Its family‑level transceiver options and high pin count make it suitable for demanding communications, processing, and control applications where on‑chip integration reduces system complexity.

This device is well suited to design teams focused on scalability and long-term platform stability: the combination of logic capacity, memory, I/O, and industrial temperature rating supports advanced prototypes through production deployments while leveraging the Stratix V GX device family characteristics documented in the device datasheet.

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