5SGXEA9N3F45C2L

The 5SGXEA9N3F45C2L is a Stratix® V GX Field Programmable Gate Array (FPGA) in a 1932-BBGA FCBGA package designed for high-density, commercial-grade logic integration. With 840,000 logic elements and approximately 53 Mbits of embedded memory, this device targets complex digital designs that require large on-chip resources and a high I/O count.

Engineered for surface-mount PCB implementations, the device offers a low-voltage core operating range and commercial temperature rating, making it suitable for demanding system and board-level applications where integration density and efficient power delivery are key considerations.

Key Features

• Logic Capacity  840,000 logic elements to support large-scale digital designs and extensive custom logic implementation.
• Embedded Memory  Approximately 53 Mbits of on-chip RAM for buffering, state storage, and memory-intensive logic functions.
• I/O Count  840 user I/O pins to accommodate wide parallel interfaces and diverse peripheral connections.
• Power and Core Voltage  Core supply voltage range 820 mV to 880 mV, enabling operation within a defined low-voltage domain.
• Package and Mounting  1932-BBGA (FCBGA) package; supplier device package listed as 1932-FBGA, FC (45×45). Surface-mount for compact board-level integration.
• Operating Grade and Temperature  Commercial grade with an operating temperature range of 0 °C to 85 °C.
• Standards Compliance  RoHS compliant.

Typical Applications

• High-density digital systems  Implement complex processing pipelines and custom accelerators using the device's large logic and memory resources.
• High-channel I/O designs  Use the 840 available I/O pins for wide data buses, multi-channel interfaces, or extensive peripheral connectivity.
• Embedded memory-centric functions  Leverage approximately 53 Mbits of on-chip RAM for buffering, packet processing, or stateful logic without external memory dependence.

Unique Advantages

• High integration density: 840,000 logic elements reduce the need for multiple devices and simplify system architecture.
• Substantial on-chip memory: Approximately 53 Mbits of embedded RAM supports large data structures and reduces external memory traffic.
• Extensive I/O capability: 840 I/O pins provide flexibility for complex interface requirements and multi-channel I/O designs.
• Compact surface-mount package: 1932-BBGA FCBGA enables dense board layouts while providing a high pin count footprint.
• Defined low-voltage core: 820–880 mV supply range supports predictable power-domain design and regulator selection.
• Commercial-grade reliability: Rated for 0 °C to 85 °C operation and RoHS compliant for mainstream electronic products.

Why Choose 5SGXEA9N3F45C2L?

The 5SGXEA9N3F45C2L combines very large logic capacity, substantial embedded memory, and a high I/O count in a single commercial-grade Stratix V GX FPGA package. It is positioned for designers who need to consolidate complex digital functions, implement memory-heavy logic, and support extensive peripheral connectivity on compact PCBs.

For development teams and procurement focused on scalable, high-density FPGA solutions, this device offers a clear hardware platform with defined electrical and environmental parameters to support board-level integration and system design continuity.

Request a quote or submit a procurement inquiry to evaluate the 5SGXEA9N3F45C2L for your next design.