5SGXEA9N3F45C3G

The 5SGXEA9N3F45C3G is a Stratix® V GX Field Programmable Gate Array (FPGA) IC from Intel, designed for high-density digital integration. This commercial-grade device delivers 840,000 logic elements and large on-chip memory to support complex system designs that require extensive programmable logic and I/O bandwidth.

The device datasheet documents electrical and switching characteristics for the Stratix V family, including operating conditions, power consumption, transceiver specifications, core and periphery performance, and I/O timing—information useful for system-level integration and performance planning.

Key Features

• High Logic Capacity — 840,000 logic elements for implementing large finite-state machines, processors, or deeply pipelined datapaths.
• Embedded Memory — Approximately 53.25 Mbits of on-chip RAM to support buffers, FIFOs, and memory-intensive algorithms without external memory dependence.
• Extensive I/O — 840 user I/Os to enable dense external interfacing and complex board-level connectivity.
• Power Supply — Core voltage supply range of 820 mV to 880 mV for defined power planning and regulator selection.
• Commercial Temperature Grade — Rated for 0 °C to 85 °C operation to match typical commercial deployments.
• Package and Mounting — Surface-mount 1932-BBGA FCBGA package (supplier package: 1932-FBGA, FC 45×45) for high I/O density and compact board layouts.
• RoHS Compliant — Meets RoHS requirements for environmental and process compatibility.

Typical Applications

• High-density system integration — Use the large logic capacity and abundant I/O for consolidating multiple functions into a single FPGA-based subsystem.
• High-throughput data buffering and processing — On-chip memory and extensive logic resources enable implementation of complex buffering, packet processing, and streaming algorithms.
• Interface and protocol bridging — High I/O count supports multiple simultaneous external interfaces for protocol conversion and aggregation tasks.

Unique Advantages

• Substantial logic resources — 840,000 logic elements reduce the need for multiple devices, simplifying board-level design and lowering BOM complexity.
• Significant on-chip RAM — Approximately 53.25 Mbits of embedded memory support memory-hungry functions without immediate external memory.
• High I/O density — 840 I/Os permit flexible connectivity and support for dense multi-channel interfaces.
• Defined commercial operating window — Specified 0 °C to 85 °C temperature range and RoHS compliance help align the device with commercial product lifecycles and regulatory expectations.
• Compact, high-pin-count packaging — 1932-BBGA FCBGA package allows maximum I/O in a compact footprint for space-constrained designs.

Why Choose 5SGXEA9N3F45C3G?

The 5SGXEA9N3F45C3G positions itself as a high-capacity Stratix V GX FPGA for commercial applications requiring large programmable logic, extensive embedded memory, and dense I/O. Its combination of 840,000 logic elements, approximately 53.25 Mbits of on-chip RAM, and 840 user I/Os is suited to complex signal processing, interface consolidation, and high-throughput data handling.

Designed for engineers who need predictable electrical characteristics and package density, this Stratix V GX device is a practical choice for scaling advanced digital designs while relying on documented device datasheet information for integration and verification.

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