5SGXEA9N3F45C3N

The 5SGXEA9N3F45C3N is a Stratix® V GX field-programmable gate array (FPGA) IC manufactured by Intel. This commercial-temperature-grade device combines a high logic capacity with large on-chip RAM and a high I/O count to support complex, high-density digital designs.

With 840,000 logic elements and approximately 53.25 Mbits of embedded memory, the device is intended for designs that require substantial logic resources, abundant on-chip storage and extensive external interfacing, delivered in a 1932-BBGA surface-mount package.

Key Features

• Core Logic  840,000 logic elements for implementing large, complex digital designs.
• Embedded Memory  Approximately 53.25 Mbits of on-chip RAM to support buffering, caching and high-throughput data paths.
• High I/O Density  840 user I/Os to accommodate wide parallel interfaces and multiple high-pin-count peripherals.
• Package & Mounting  1932-BBGA (supplier package: 1932-FBGA, FC 45×45) in a surface-mount form factor for compact, high-density board layouts.
• Power Supply  Core voltage supply range of 820 mV to 880 mV for defined power and signaling conditions.
• Commercial Temperature Grade  Rated for operation from 0 °C to 85 °C, suitable for standard commercial environments.
• RoHS Compliant  Meets RoHS requirements for materials compliance.

Typical Applications

• High-density digital processing  Use the large logic and memory resources to implement complex DSP stacks, custom accelerators or protocol engines.
• I/O-intensive systems  Leverage 840 I/Os for wide parallel buses, multi-channel data acquisition or extensive sensor/peripheral interfacing.
• Prototype and platform development  Deploy this Stratix V GX device in FPGA-based prototypes that require near-production-scale logic and memory capacity.

Unique Advantages

• Massive logic capacity: 840,000 logic elements let you consolidate large portions of system logic onto a single device, reducing component count.
• Substantial on-chip memory: Approximately 53.25 Mbits of embedded RAM supports larger buffers and local storage, improving data throughput and latency.
• Extensive I/O: 840 I/Os simplify board-level routing for multi-channel systems and reduce the need for external multiplexing.
• Compact, production-ready package: The 1932-BBGA surface-mount package provides a high-pin-count solution in a compact footprint for dense PCB designs.
• Commercial temperature rating: Rated 0 °C to 85 °C for reliable operation in standard commercial environments.
• Regulatory readiness: RoHS compliance supports deployment in regions and products requiring restricted-substance conformity.

Why Choose 5SGXEA9N3F45C3N?

The 5SGXEA9N3F45C3N positions itself as a high-capacity Stratix V GX FPGA suitable for designs that demand large logic arrays, sizable on-chip memory and broad I/O connectivity. Its commercial temperature rating and surface-mount 1932-BBGA package make it appropriate for compact, board-dense systems intended for standard commercial use.

Designers and procurement teams seeking a single-chip solution to integrate extensive digital logic, embedded memory and high I/O counts will find this device aligns with complex prototyping and production-oriented FPGA applications while maintaining material compliance.

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